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JPH11123657A |
To provide a CAD/CAM device and a processing device considering power information which allow an automatic processing to emphasize the accuracy of surface roughness and the like, by considering the power information. The modeling of the ...
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JP2880569B2 |
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JP2882458B2 |
Picking up means pick up a wafer from a first cassette one by one and carry the wafer to a pre-processing means. The wafer is picked up from the pre-processing means after the measuring and deciding the position has been completed in the...
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JP2880567B2 |
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JP2877630B2 |
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JP2846881B2 |
In a numerical control grinding machine using a grinding wheel made of cubic boron nitride, a computerized numerical controller controls the infeed movement of a wheel head to effect a rough grinding, a drifty grinding and a fine grindin...
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JP2839685B2 |
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JPH10277903A |
To facilitate an input command of a numerical value and change command of a display screen by commanding the value of an input item, which is selected by rotatable rotary member, based on the rotation direction and the rotation speed. An...
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JP2808485B2 |
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JPH10249689A |
To make a wafer, formed with an orientation flat or notch on the circumference, so as to be accurately chamferable. A wafer W supported free of rotation is supported free of both X and Y axial directions orthogonal with each other, and a...
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JP2786879B2 |
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JP2764012B2 |
PURPOSE: To carry out grinding work only for positions to be processed by inputting processing data obtained from a grinding system to be employed and a finishing diameter and both end positions, and mounting a processing means which mov...
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JP2740925B2 |
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JPH1076456A |
To simplify physical distribution of slabs, and improve production efficiency in a flaw elimination facility. A slab 24 cast and cut in a continuous casting facility 22 is transferred by a carrier crane 30 to a carrier line 32 or a desca...
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JPH1076430A |
To manufacture slices in an automated method at an extremely high output, with improved reliability and safety, in uniform and excellent quantity, and at low cost. A device is provided with a first structure 23 for executing necessary wo...
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JPH1063089A |
To provide a manufacturing method for a developing roller without having any difference in density between an initial stage state and a state after printing was repeated, in the result of printing. A prototype roller 13 secondarily vulca...
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JP2714457B2 |
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JP2711926B2 |
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JP2677031B2 |
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JPH09253977A |
To enable a moving path of a machining means to be easily attained without performing any complex calculation. An outer shape P of a sectional surface 3 of a part to be processed when a part C to be processed is sliced into a specifies t...
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JP2549664Y2 |
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JPH09199454A |
To eliminate the affection of saw mark generated when a silicon ingot is cut by a method wherein one surface of a silicon wafer is treated by adsorbing to a porous elastic soft chuck of hardness lower than the silicon wafer, and then oth...
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JPH09506213A |
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polis...
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JP2619497B2 |
A grinding machine for grinding outer and/or inner surfaces of a workpiece which is provided on its indexable wheel head with an outer surface grinding wheel, inner surface grinding wheel and a measuring device having a touch probe engag...
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JPH09153538A |
To provide a substrate processor capable of putting in order of the directions of all substrates to be delivered to respective processing parts. This substrate processor is provided with a wafer edge exposure device 20 as one of the proc...
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JPH09136255A |
To carry out surface grinding of the friction surface of a pad and chamfering of corner parts by a single tool without replacing it with another by providing a numerical control circuit part for controlling the feeding operations of an X...
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JPH09136256A |
To continuously perform a cutter-grooving processing process and a cylindrical grinding wheel-processing process by providing a numerical control circuit part for controlling the rotating action by a Z-axis rotation mechanism, and the fe...
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JP2604878B2 |
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JPH0970754A |
To provide a continuous polishing control method of a steel plate in coil which can maintain a polished grain of the steel plate in coil uniformly in the longitudinal direction irrespective of wear of a polishing belt. When surface polis...
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JP2528191Y2 |
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JPH0957619A |
To generate a surface processed having a shape symmetric about a rotary shaft with high shape accuracy while high processing efficiency is ensured by the use of a device configuration which can work well with the varying actual processes...
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JP2527274Y2 |
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JP2584104B2 |
A grinding wheel form defining device defines a cross-sectional form of a grinding wheel for grinding works, the cross-sectional form including a grindstone axis. Data storage is provided for storing cross-sectional forms of workpieces w...
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JP2582788B2 |
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JPH0947947A |
To perform a polishing work wherein the generation of a chage of properties layer is reduced by a method wherein a cylinder grinding wheel having a specified thickness or more is rotated on a grinding wheel shaft and the grinding wheel s...
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JPH0938859A |
To efficiently perform inner side grinding with high accuracy without requiring any skill and intuition by arranging a contact type sensor adjacent to a grinding tool supporting base on a table for NC lathe. An inner diameter of a work 9...
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JP2575960B2 |
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JP2576988B2 |
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JPH0919859A |
To work the deep recess surface of a dent with a high accuracy by forming spherically the polishing part of a grinding wheel, and arranging the grinding wheel axis at a certain angle to the Z-axis. A spherical grinding wheel 3a having a ...
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JP2572577B2 |
An apparatus for polishing semiconductor material having a movable polishing arm 10 which is mounted to a cabinet 17. Connected to the polishing arm 10 is a workpiece holder sometimes referred to as a wafer chuck 11. Adjacent to the poli...
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JPH08339219A |
PURPOSE: To easily and quickly teach a polishing surface by interpolating parts set among the teaching points arrayed in a 1st prescribed direction by a straight line and interpolating the parts set among the teaching points arrayed in a...
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JPH08309648A |
PURPOSE: To enhance efficiency of a process of polishing work and to improve accuracy of polishing work in a polishing system provided with a shape measuring device and a polishing device. CONSTITUTION: This polishing system is construct...
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JP2555373B2 |
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JP2554408B2 |
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JP2552743B2 |
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JPH08510695A |
A method of polishing an object is disclosed. In one embodiment, as shown in the figure, the method comprises the steps of creating a polishing zone (10) within a magnetorheological fluid (2); determining the characteristics of the conta...
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JPH08257906A |
PURPOSE: To set polishing conditions such as a setting position of sanitary earthenware onto a polishing device and the amount of polishing precisely in a short time, in polishing work for placing a shape of sanitary earthenware such as ...
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JPH08229812A |
PURPOSE: To improve work efficiency, reduce labor, and perform favorable grinding and polishing without irregularity in finished form and precision of cast products by automating change of grinding wheels in accordance with grinding/poli...
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JPH08197402A |
PURPOSE: To polish a plurality of periphery edges at the same time and improve polishing workability and polishing accuracy by providing four polishing machines opposite to respective edges of a glass plate set in designated position on ...
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JPH08187660A |
PURPOSE: To form a device suited for forming a block and enhance the efficiency of cooperating with an auxiliary equipment by providing a control soft in each block of a load/unload block, conveying block, polishing block and a washing b...
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