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JP4825388B2 |
A pre-cutter or edger machine for processing the periphery of an optic is provided. The pre-cutter or edger machine of the present invention is advantageous in that it provides a machine that eliminates the need to mount the optic on a b...
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JP4820039B2 |
For the working of walls which bound the cavity of a continuous casting mold, a machine is used which incorporates machining and/or polishing tools. The machine consists of a machine tool table with an arm introducible into the cavity fo...
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JP2011527947A |
An assembly for cutting a plurality of substrates into individual integrated circuit units includes a first block for receiving a first substrate. The first block is movable between a first loading position, a first alignment inspection ...
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JP4808453B2 |
A polishing method that carries out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps thereby ...
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JP4778790B2 |
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JP2011173188A |
To efficiently and effectively attain automation of a chamfering work to a plurality of kinds of works.A work data generating device (10) includes a collating data generating means (12) for generating collating data which is collated wit...
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JP4740540B2 |
A method and a controller for the chemical mechanical polishing (CMP) of substrates and, in particular, for the chemical mechanical polishing of metallization layers is disclosed. In a linear model of the CMP process, the erosion of the ...
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JP4739784B2 |
A control unit (39) regulates a positioning device (38) that moves a grinding tool (37). The unit has modules to respectively guide the tool for machining predetermined face-end and circumferential chip spaces, and determine a corner cut...
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JP4741212B2 |
A method of polishing an object is disclosed. In one embodiment, as shown in the figure, the method comprises the steps of creating a polishing zone (10) within a magnetorheological fluid (2); determining the characteristics of the conta...
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JP4666178B2 |
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JP2011005625A |
To provide a method and an apparatus for grinding a cutting tool by CAD/CAM technology.The method for grinding is used for grinding the cutting tool adopting a grinding stone. The method comprises a step of establishing grinding stone da...
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JP4607324B2 |
A CNC tool grinding machine has at least one rotatable grinding wheel (1) movable relative to a workpiece (2) for grinding a flute surface (3) of a blade in the workpiece (2). The machine is programmed with a path for the grinding wheel ...
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JP4516347B2 |
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JP4487387B2 |
An apparatus for measuring a circularity deviation of a cylinder of an object intended to be integrally rotated about a rotation axis, the cylinder being eccentric as either intended or not with the rotation axis, the apparatus includes ...
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JP4473457B2 |
The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid partial section of an undulated workpiece du...
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JP2010027701A |
To precisely predict a polishing rate of a wafer for the next session with no test polishing when switching a kind of film of the wafer to be dealt with.The measurement value of all or a part of device state parameters comprising a torqu...
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JP4387010B2 |
A cutting apparatus (2) comprising a rotary shaft (34) which is detachably fitted with a rotary tool (36) including a cutting blade (44). A storage case (162) storing the rotary tool (36) has an indicator (156) which may be a bar code an...
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JP4340233B2 |
An apparatus for removing material from microelectronic substrates, comprising: a support member configured to releasably carry a microelectronic substrate; a first electrode spaced apart form the microelectronic substrate when the micro...
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JP2009125905A |
To prevent a defective part from being formed due to the deterioration of substrate processing accuracy when a line is automatically restarted after a stop regarding an operation control method of the substrate processor that performs co...
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JP2009026850A |
To make a film to be polished on a wafer have a constant film thickness during high-speed polishing even if a polishing pad has variance in thickness.A novel polishing pad 13 is set on a rotary platen 14 of a CMP device. Then the thickne...
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JP4169923B2 |
A lens grinding method and apparatus for changing a lens rotation speed when grinding a spectacle lens by using spectacle frame lens shape information, spectacle lens information such as spectacle lens material, and various spectacle pro...
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JP4171363B2 |
A process for generating a curved surface on a workpiece with high speed is disclosed, in which an acceleration of a slider(12) is set to a predetermined desired acceleration while a rotating velocity of a work spindle(14) is made varied...
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JP4121696B2 |
Methods and apparatuses for spectacle lens chamfering, wherein a predetermined chamfer width is inputted from a peripheral edge of a lens shape of a spectacle frame and a chamfer locus on a refraction plane of a spectacle lens is obtained.
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JP4094816B2 |
An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several milliont...
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JP4068177B2 |
An eyeglass lens is designed to permit the operator to preset by himself the conditions for bevel formation in AUTO mode so that he can perform efficient lens processing. The eyeglass lens grinding apparatus includes frame data inputting...
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JP2008023691A |
To suppress an affected layer regardless of the flow rate control on grinding fluid.This grinding device 1 is provided with a wheel spindle stock 3 movably supported by a grinding machine body 7, a grinding wheel 5 supported by the wheel...
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JP4034868B2 |
A lens grinding apparatus that can process the edge of a lens to have a satisfactory polished surface and fit snugly into the user's eyeglass frame. The apparatus includes frame configuration data input device for entering data on the co...
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JP4034848B2 |
An eyeglass lens grinding apparatus which is adapted to be operable with different arrangements of abrasive wheels using a smaller number of software programs that have to be made available separately and which can be managed easily. In ...
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JP4033001B2 |
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JP2007531929A |
A flexible process optimizer for recording and analyzing various parameters to improve the efficiency of a production process. The flexible process optimizer acquires and conditions signals from a variety of transducers mounted on a prod...
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JP3994393B2 |
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JP3979750B2 |
The present invention relates to a method and apparatus for polishing a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display to a flat mirror finish, and then cleaning a polished substrate that requires...
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JP2007220842A |
To provide a method for polishing a wafer in which the parameters of a processing process model can be determined automatically from the production start achievement data in mass production, such that the precision is enhanced in film th...
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JP3961196B2 |
To provide a spectacle lens machining device capable of partially changing lens edge machining and increasing degree of freedom of a design of a frame or the like. This spectacle lens machining device comprises an edge machining means th...
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JP2007181889A |
To effectuate the whole of a system in composing various working mechanisms without complicating an inside mechanism of a device main body.This glass lens working system is furnished with the working device main body to compute a lens ed...
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JP2007140373A |
To provide a method capable of completely automatically grinding and polishing both sides of glass for liquid crystal.This method comprises: a step for grinding or polishing a counter substrate by using a sending-out side cassette means ...
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JP3923047B2 |
To reduce the stress generated between motors when one object is driven by a plurality of motors and synchronously controlled. The force acting between the motors is determined and controlled to be reduced, as substitute for controlling ...
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JP2007098554A |
To provide a double-headed surface grinding device capable of stabilizing the accuracy of processing a workpiece without making sharpening at regular intervals when a grinding element equipped with a self-regenerating function is used wh...
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JP2007054896A |
To obtain a favorable ground surface by preventing a grinding mark using a simple method without complicating the device and the process.The rotational frequency of a chuck rotating shaft 15 is varied so that the rotational frequency rat...
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JP3878519B2 |
To provide a grinding method causing little a fluctuation in grinding accuracy even when simultaneously grinding a plurality of grinding object surfaces of a workpiece by a plurality of grinding wheels. This grinding method simultaneousl...
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JP3870950B2 |
To provide a method for grinding a circular cross section thin wall member for grinding the circular cross section thin member with high circularity by improving machining efficiency as much as possible by a simple mechanism and suppress...
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JP3850224B2 |
To provide a grinding processing method and a numerical control grinding machine for executing the grinding processing method in which a recessed part is not generated on a contact surface of a work at the time of completion of the grind...
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JP3846706B2 |
In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing ...
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JP3841491B2 |
To prevent contamination caused by grinding liquid in a previous stage so as to prevent a reduction in quality or yield by providing a cleaner for cleaning a material ground in a grinding unit being removed from a top ring. In the case o...
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JP2006524142A |
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and ...
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JP2006240744A |
To provide a hard package for tobacco products including a hinge-type lid which is easy in manufacturing, inexpensive, and which prevents the deformation of the lid particularly.The package has a parallelepipedic container 2 of a cup for...
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JP3821909B2 |
To distribute a cutting force and cut a work with a uniform force by rotating a cutting tool at high speed by a trace quantity by a high-speed rotation motor so as to cut the work and rotating the cutting tool by a low- speed rotation mo...
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JP3787248B2 |
To solver a problem that in a twin head grinder for separately working different working parts at the same time with two grinding wheels, sometimes the grinding cannot be performed at the same time, and when one of twin heads performs th...
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JP2006130627A |
To manufacture a precise roller of an elastic body by suppressing the run-out of the roller of the elastic body by reducing its deflection through reducing the grinding resistance, and further by eliminating the generation of chatter.In ...
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JP2006513869A |
In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of feedback controls within the abrasive manu...
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