| Document |
Document Title |
|
WO/2020/058370A1 |
Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device comprises an under-bump metallization component (124B) that comprises a superconducting interconnect co...
|
|
WO/2020/054737A1 |
The objective of the present invention is to provide a coated arc welding rod with which it is possible to suppress one-sided melting and arc biasing and to cause a molten droplet to migrate smoothly, with which arc stability is satisfac...
|
|
WO/2020/054564A1 |
In flux-free brazing, the objective of the present invention is to provide a method for manufacturing a brazing sheet with which it is possible to suppress a deterioration in brazing performance resulting from variations in dew point and...
|
|
WO/2020/054325A1 |
An aluminum alloy brazing sheet that comprises a sacrificial material, which has the function of a brazing material, on at least one surface of a core material. The sacrificial material has a composition that contains, in mass%, 2-5% of ...
|
|
WO/2020/054288A1 |
Provided is a conductive material, the storage stability of which can be efficiently increased and which can be densely filled with flux, and which can also efficiently increase solder coalescing properties during conductive connection. ...
|
|
WO/2020/054581A1 |
One aspect of the present invention is a method of manufacturing an electronic component, the method comprising: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a m...
|
|
WO/2020/050120A1 |
A vehicle window glass assembly according to one embodiment of the present disclosure comprises: a vehicle window glass plate wherein an electroconductive layer containing a prescribed pattern of silver is formed on a principal surface o...
|
|
WO/2020/047481A1 |
Some implementations of the disclosure are directed to low melting temperature (e.g., !iquidus temperature below 210°C) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60wt% Bi; optionally, one or more of: up to 16 w...
|
|
WO/2020/044650A1 |
Provided is a novel lead-free soldering alloy that can be used in a high temperature range. This soldering alloy contains Sn, Bi, and Cu, wherein the Sn content is 1.9 to 4.3% by mass, the Cu content is 1.9 to 4.5% by mass, the remainder...
|
|
WO/2020/047442A1 |
The present application relates to a gas control system and method for a reflow soldering furnace, comprising: an oxygen detecting device, capable of coming into contact with a gas in a furnace chamber, for detecting an oxygen concentrat...
|
|
WO/2020/040128A1 |
This brazing material, for brazing aluminum or an aluminum alloy, contains a fluoride-base flux, a solidifying agent, and an organic viscosity reducing agent, and is solid at 25°C.
|
|
WO/2020/039643A1 |
The present invention provides a solid wire that is for gas metal arc welding, that generates less fumes during welding, and that is suitable as a welding material for a high-Mn steel material. The solid wire for gas metal arc welding ac...
|
|
WO/2020/040733A1 |
A method of repairing an airfoil is provided. The method includes providing an airfoil with a damaged section and removing the damaged section by machining or cutting an upper section of the airfoil. A replacement section is configured t...
|
|
WO/2020/039497A1 |
This brazing material, for brazing aluminum or an aluminum alloy, contains a fluoride-base flux, wax, and an organic viscosity reducing agent, and is solid it 25°C.
|
|
WO/2020/031631A1 |
A cylindrical sputtering target according to the present invention is provided with: a sputtering target material forming a cylindrical shape; and a backing tube joined through a solder layer to the inner circumferential side of the sput...
|
|
WO/2020/031825A1 |
Provided is a flux composition that can be coated without performing a film forming step, and also provided are a soldering paste, a solder joint, and a solder joining method, which use this flux composition. This flux composition compri...
|
|
WO/2020/031693A1 |
This flux contains a solvent and a thixotropic agent, wherein the solvent contains a carboxylic acid that is a liquid at ordinary temperature.
|
|
WO/2020/032964A1 |
A turbine blade airfoil portion having a total length and fixedly attached to a base includes a first portion extending from the base to a repair line such that the first portion has a first length that is shorter than the total length, ...
|
|
WO/2020/033478A1 |
A system and method of purge testing for welding piping, including flowing a purge gas through a test pipe, determining concentration of a gas component in the purge gas discharged from the test pipe, and determining a time period to rea...
|
|
WO/2020/033631A1 |
Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle p...
|
|
WO/2020/031361A1 |
The invention of the present application addresses the problem of providing a lead-free solder alloy, which does not undergo the occurrence of cracking at a solder joint part even under such a severe environment (-40°C to 150°C) where ...
|
|
WO/2020/026385A1 |
The chemical composition of this weld metal, by mass% with respect to the total mass of the weld metal, consists of 0.03-0.15% of C, 0.15-0.80% of Si, 1.2-2.0% of Mn, 0.025% or less of P, 0.020% or less of S, 0-0.050% of Al, 0.005-0.34% ...
|
|
WO/2020/022046A1 |
[Problem] To realize brazing of alumina dispersion strengthened copper. [Solution] GlidCop (registered trademark), which is alumina dispersion strengthened copper, and another metal are prepared, and surfaces thereof to be joined are fin...
|
|
WO/2020/021760A1 |
This method of manufacturing a semiconductor device includes: a step of preparing a second laminate which is obtained by mounting a first laminate on a base substrate via a solder sheet; a step of installing the second laminate inside a ...
|
|
WO/2020/021967A1 |
Provided are a soldering alloy and a solder joint which have high tensile strength and which can suppress Ni erosion while suppressing the occurrence of a void in the joining interface. This soldering alloy has an alloy composition compr...
|
|
WO/2020/017154A1 |
This solder alloy is characterized by having an alloy composition of As: 25-300 ppm by mass, Pb: greater than 0 and less than or equal to 5100 ppm by mass, at least one of Sb: greater than 0 and less than or equal to 3000 ppm by mass and...
|
|
WO/2020/016535A1 |
The invention relates to an assembly method, comprising the following successive steps: a) providing at least two parts (10, 20) made of ceramic materials obtained by sintering non-metallic inorganic powders or a ceramic matrix composite...
|
|
WO/2020/017064A1 |
This composition contains: a metal component which can undergo transitional liquid-phase sintering; and an organic component. The metal component contains: metal particles A having a melting point higher than 300°C; and metal particles ...
|
|
WO/2020/017157A1 |
This solder alloy has an alloy composition of As: 25-300 ppm by mass, Bi: 0-25,000 ppm by mass and Pb: greater than 0 and less than or equal to 8000 ppm by mass, with the remainder consisting of Sn, and satisfies formula (1) and formula ...
|
|
WO/2020/017049A1 |
Provided is a composition containing: a metal component which can undergo transitional liquid-phase sintering; and an organic component. The metal component contains: metal particles A having a higher melting point than 300°C; and metal...
|
|
WO/2020/012925A1 |
The present invention relates to a flux-cored wire for two-phase stainless steel welding that comprises: at least one strong deoxidizing element chosen from the group consisting of Al, Mg, rare earth elements, Ca, Zr, and Ti; and a slag-...
|
|
WO/2020/012226A1 |
The present application concerns an additivated solder paste and a process to apply a reactive additive element for the control of the soldering temperature of electronic components on the reflow soldering method by the use of metallic p...
|
|
WO/2020/007583A1 |
The invention relates to a method for producing a high-temperature-resistant lead-free solder joint (7; 71) between a circuit board (1) and a part (2; 2b), wherein a lead-free solder preform (3; 3b) is used that has a composite material ...
|
|
WO/2020/004543A1 |
Provided are: a low-residue and highly processable flux for resin flux cored solders and flux-coated solders; a resin flux cored solder and a flux-coated solder which use said flux; and a soldering method. The flux for resin flux cored s...
|
|
WO/2020/004510A1 |
A method for producing an anisotropic conductive film, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the so...
|
|
WO/2020/006205A1 |
Disclosed herein are embodiments of copper-based alloys. The alloys can comprise hard phases of silicides and can be free or substantially free of Co, Mn, Mo, Ta, V, and W. The copper-based alloys can be used as feedstock for PTA and las...
|
|
WO/2020/004511A1 |
A method for producing solder particles, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the solder fine part...
|
|
WO/2020/004513A1 |
The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anis...
|
|
WO/2020/000083A1 |
A system includes a laser welder and a filler wire feed. The laser welder is configured to weld a workpiece to at least one additional workpiece to form a welded assembly. Each of the workpieces is formed from a steel material and compri...
|
|
WO/2020/001418A1 |
A cable-type welding wire, comprising a central welding wire and n peripheral welding wires arranged so as to be spirally wound on the central welding wire, wherein all the peripheral welding wires have a diameter of dex, and adjacent pe...
|
|
WO/2020/004512A1 |
The present invention relates to a solder paste which contains solder particles and a flux. A part of the surface of the solder particles has a flat portion. By using solder particles having a flat portion on a part of the surface thereo...
|
|
WO/2020/002890A1 |
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
|
|
WO/2019/240941A1 |
A brazing process using metal carbon alloys for joining ceramics to ceramics, ceramics to metals, and metals to metals. The joined pieces can be used in a wide variety of applications, and can include semiconductor processing equipment p...
|
|
WO/2019/235001A1 |
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where ...
|
|
WO/2019/234209A1 |
The present invention concerns a concentrate comprising at least one brazing flux, at least one binder and water in a specific ratio; a process for the manufacture of a brazing flux paint composition which comprises the steps of a) provi...
|
|
WO/2019/232162A1 |
The disclosure describes techniques for eliminating or reducing non- wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The ...
|
|
WO/2019/230694A1 |
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount ...
|
|
WO/2019/227756A1 |
A solder preform. At least one surface of a solder (C) is provided with multiple protrusions spaced apart from one other at a certain distance and/or multiple recessed portions spaced apart from one other at a certain distance.
|
|
WO/2019/231749A1 |
A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both hig...
|
|
WO/2019/224290A1 |
The present disclosure relates to an austenitic nickel-base alloy having a high content of Ni, Mo and Cr which is suitable for use as a weld metal. Weld metal containing the present austenitic nickel-base alloy will have a high resistanc...
|
