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WO/2021/058133A1 |
A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt.% of the metal complex, based on the total weight of the sintering co...
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WO/2021/054197A1 |
The present invention provides an adhesive which is capable of maintaining the bonding strength between substrates even if heated repeatedly, while being capable of controlling the gap of an air cavity with high accuracy. An adhesive a...
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WO/2021/054195A1 |
The present invention provides an adhesive for air cavity formation, said adhesive being capable of controlling the gap of an air cavity with high accuracy. An adhesive for air cavity formation according to the present invention is use...
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WO/2021/054194A1 |
Provided is an adhesive capable of controlling the gap of an air cavity with high accuracy even when repeatedly heated. The adhesive according to the present invention is for bonding metals in a first substrate having a first metal por...
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WO/2021/053900A1 |
Provided is a wire for gas-shielded arc welding with which little spatter is generated during welding, a step for removing slag is not required after the welding, and a weld part having excellent electrodeposition coating properties can ...
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WO/2021/054196A1 |
The present invention provides an adhesive which is capable of maintaining the bonding strength between substrates even if heated repeatedly, while being capable of controlling the gap of an air cavity with high accuracy. An adhesive a...
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WO/2021/049440A1 |
Provided is a submerged arc welding flux that is excellent in terms of slag separation while suppressing the occurrence of iron particles and pockmarks, regardless of the execution conditions. The submerged arc welding flux is used for s...
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WO/2021/049437A1 |
Provided are an Sn-Bi-In-based low melting-point joining member used in a Pb-free electroconductive joining method in mounting a semiconductor component and usable for low-temperature joining, and a production method therefor. The Sn-B...
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WO/2021/049643A1 |
The purpose of the present invention is to provide a lead-free solder alloy and a solder bonded body that, despite no addition of "Ni", have solderability and bonding characteristics as with a "Ni"-added lead-free solder alloy. This le...
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WO/2021/048374A1 |
The present invention relates to a method for manufacturing composite solder balls that are metallised on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter D0 made of expande...
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WO/2021/051078A1 |
Described herein are methods for and devices prepared from welding shape memory alloys. The weld produced from the present methods can approach 100% joint strength relative the ultimate tensile strength of the shape memory alloy, and are...
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WO/2021/045131A1 |
According to the present invention, a solder bonded body that has more excellent heat resistance, thermal conductivity and reliability than ever before is able to be formed by a solder paste which contains a lead-free solder alloy powder...
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WO/2021/043708A1 |
The present invention relates to a lead-free solder alloy which consists essentially of or consists of: from 0.01 to 11 wt.% of zinc (Zn); from 0.01 to 6 wt.% of bismuth (Bi); from 0.01 to 2 wt.% of gallium (Ga); and, tin (Sn), wherein s...
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WO/2021/043547A1 |
By means of a special selection of the elements silicon, boron, zirconium, and hafnium for a nickel-based superalloy, crack-free samples can be produced even in an additive method. The nickel-based superalloy has, in particular consists ...
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WO/2021/043913A1 |
The present disclosure relates to a new welding material having a composition which will provide the material with better mechanical properties as well as better corrosion resistance and weldability.
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WO/2021/043437A1 |
A lead-free solder alloy comprising: from 2.5 to 5 wt.% silver; from 0.01 to 5 wt.% bismuth; from 1 to 7 wt.% antimony; from 0.01 to 2 wt.% copper; one or more of: up to 6 wt.% indium, up to 0.5 wt.% titanium, up to 0.5 wt.% germanium, u...
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WO/2021/045920A1 |
A closure element for an internal passage in a component, and a related method and turbine blade or nozzle are disclosed. The closure element includes a spherical body made of a first superalloy, and a plurality of extensions extending f...
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WO/2021/041845A1 |
The present disclosure relates to tubular welding electrodes that have a metallic sheath surrounding a granular core, wherein the metallic sheath comprises a metal matrix composite (MMC) that includes a ceramic material and aluminum or a...
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WO/2021/033624A1 |
A brazing material for brazing aluminum or an aluminum alloy includes fluoride-based flux, a solidifying agent, and a coating homogeneity supplement, the brazing material being solid at 25°C.
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WO/2021/032350A1 |
The invention relates to a method for integrally joining components, wherein (a) a component (1) and a component (2) are provided, (b1) a layer of copper paste is applied to one of the surfaces to be joined, a soldering agent is then app...
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WO/2021/032249A1 |
The invention relates to a method of manufacturing a mold insert (1) for the production of moldings, in particular blocks or slabs, in which a plurality of strips (2, 2a, 2b) that form wall elements of the mold insert (1) to be manufactu...
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WO/2021/033936A1 |
One embodiment of the present invention provides a lead-free alloy for soldering, comprising, on the basis of the total weight, 35-50 wt% of bismuth (Bi), 0.1-1.5 wt% of copper (Cu), 1-6 wt% of indium (In), and the balance of tin (Sn) an...
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WO/2021/029222A1 |
Provided are: a solder alloy having high tensile strength and capable of preventing the occurrence of Ni erosion and also preventing the formation of voids at a bonding interface; and a solder joint. The solder alloy has an alloy composi...
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WO/2021/028283A1 |
The invention relates to the fields of technical ceramics and materials science and relates to high-temperature active solders, such as can be used for example for soldering oxide and non-oxide ceramics or ceramics with metals, which are...
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WO/2021/024568A1 |
An electronic control device is provided with a circuit substrate, an electronic component, and a joint part for joining the circuit substrate and the electronic component to each other, wherein the joint part contains Sn as the main com...
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WO/2021/025081A1 |
Provided is a solder-metal mesh composite material characterized in that a metal mesh that exhibits high thermal conductivity is contained within a lead-free solder layer formed from a Sn-Cu-Ni-based lead-free solder, the proportion of p...
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WO/2021/021687A1 |
Ceramic welding methods and welded articles are disclosed. The present disclosure shows that transparent and diffuse ceramics can be successfully joined using lasers. The diffuse ceramic welding can be aided by introducing a small gap fo...
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WO/2021/020309A1 |
This preform solder contains a lead-free solder containing Sn as a main component, and metal particles having a melting point higher than that of the lead-free solder, wherein the metal particles are formed of a Cu-Ni alloy having a Ni c...
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WO/2021/020036A1 |
An aluminum alloy brazing sheet according to the present invention comprises: an intermediate material made of an aluminum alloy having a predetermined component composition containing 0.40-6.00 mass% of Mg; a core material made of an al...
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WO/2021/020037A1 |
An aluminum alloy brazing sheet according to the present invention is obtained by sequentially stacking a brazing filler material and a core material in this order. The core material is formed of an aluminum alloy that contains from 0.50...
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WO/2021/014452A1 |
A composition comprising 25% to 45% (w/w) rutile, 4% to 45% (w/w) alkali metal silicates, and 5% to 50% (w/w) alkali metal carbonates, is provided. Further, articles comprising the composition are provided.
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WO/2021/015821A1 |
Non-aqueous solder flux compositions are disclosed. In some aspects, the compositions comprise: (a) an alkylbenzene sulfonic acid or an acidic phosphate ester; and (b) an alkanolamide, an ethoxylated alkanolamide, an alkanolamine, or an ...
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WO/2021/014607A1 |
The flux composition according to the present invention contains a fluoride-based flux, a resin, and a solvent. The solvent is water or a water-soluble organic solvent. When a specific evaporation amount Qa for a solvent a is defined as ...
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WO/2021/014007A1 |
The invention relates to a method of connecting a terminal (22) to a substrate (12) for forming a power semiconductor module (10), wherein the terminal (22) has a first connection area (28) which is formed from a first material and where...
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WO/2021/010199A1 |
The present invention pertains to: a SnZn solder characterized in that a total 1–1.5 wt% of a principal material including at least one element from among P, In, Bi, and Sb is mixed with a base material that is an alloy of Sn and Zn, a...
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WO/2021/009078A1 |
The invention relates to a method for producing a tailored welded blank (2) from at least two blank parts (2a, 2b), of which at least one blank part (2a, 2b) is made of a press-hardenable manganese-boron steel, of which at least one blan...
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WO/2021/006040A1 |
Provided is a flux-cored wire for an Ar-CO2 mixed gas, which has excellent slag aggregation performance and slag detachment performance, and which enables the production of a welded metal having excellent low-temperature toughness. A flu...
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WO/2021/002259A1 |
Provided are: an austenitic stainless steel flux cored wire from which a welded metal having excellent cryogenic temperature toughness can be produced; a welded metal having excellent cryogenic temperature toughness; and a welding method...
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WO/2020/262632A1 |
A flux according to the present invention is a halogen-free flux used for soldering, the flux containing: a thixotropic agent including a polyamide compound in which one or a plurality of endothermic peaks obtained by differential therma...
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WO/2020/263813A1 |
A projection welding electrode holder has a holder body, a holder barrel, and a coned-disc spring. The holder body is configured for attachment to a welding machine and defines a holder body bore. The holder barrel is carried within the ...
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WO/2020/259938A1 |
The invention relates to a method for passivating an aluminium surface provided with a flux. According to the method, the aluminium surface provided with the flux is supplied. Then a passivation solution is applied to the aluminium surfa...
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WO/2020/262631A1 |
A flux according to the present invention contains a fatty acid and an imidazole compound.
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WO/2020/262040A1 |
Provided are a solder alloy with which it is possible to cast a cast article having a desired thickness, a cast article, a formed article, and a solder joint. The solder alloy has an alloy composition comprising, in terms of mass%, 0.1-2...
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WO/2020/255874A1 |
Provided is an electroconductive material with which it is possible to continuously perform an arrangement step during printing and to efficiently arrange solder on an electrode. The electroconductive material according to the present ...
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WO/2020/255808A1 |
A flux-cored wire according to the present invention comprises a flux which is a core and a hoop which is an outer skin, wherein: the flux includes a strong deoxidizing metal element (flux) containing Mg and Al, and a fluorine compound p...
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WO/2020/248660A1 |
Disclosed is an off-line programming method for motion trajectory of an impeller disk shock peening robot. In a laser shock peening application process, the method determines the motion trajectory of a robot using a robot simulation soft...
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WO/2020/248878A1 |
An Fe-Ni based alloy solder wire for 800H alloy welding, comprising the following chemical components in mass percentage: C 0.05-0.10％, Si≤1.0％, Mn≤1.5％, Ni 29.0-32.0％, Cr 17.0-19.0％, Nb 0.35-0.45％, Mo 1.50-2.50％, Al 2....
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WO/2020/246947A2 |
The invention is related to the A356 alloy used in the production of metal parts, primarily for use in the production of wheels in the automotive industry. It is characterized by the addition of 0.1 -0.9 wt. % Al-La, Al-Ce and / or Al-La...
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WO/2020/241317A1 |
The present invention addresses the problem of providing: an Sn-Bi-Cu-Ni-based solder alloy which has a low melting point, excellent ductility and high tensile strength, and also has such a property that, when the solder alloy is soldere...
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WO/2020/241437A1 |
Provided is a solder alloy having not only a long-term ability to withstand severe temperature cycle properties such as low temperatures of -40°C and high temperatures of 125°C, but also the long-term capability to withstand force from...
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