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WO/2015/150413A1 |
The invention describes an apparatus (1) and a method for soldering joining partners, in particular electrical components on printed circuit boards or other substrate elements. The joining partners can be received and pressed together be...
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WO/2015/148178A1 |
A process comprising; (a) aligning one or more terminals of an electrical component that has geometry constraints with one or more bus bars of a photovoltaic component; (b) pre~feeding flux and solder to a tip of a soldering iron; and (c...
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WO/2015/145509A1 |
A joining device of the invention of the present application has: a unit-form device body (10) including a direct current-type power supply circuit, a control circuit, a variety of drive circuits, etc., therein; a joining head (12) for c...
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WO/2015/141802A1 |
Provided are: a method that is for producing a mounting structure and that can easily produce a mounting structure in which pins and other electronic components are mounted to the same surface; a mounting jig; a device for producing a mo...
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WO/2015/091884A9 |
The invention relates to a joining device, in particular for producing a heat exchanger (26) comprising at least one cover plate or two cover plates lying opposite one another, by means of coffering and soldering, said device comprising ...
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WO/2015/132086A1 |
The invention relates to a method for manufacturing a heat exchanger, comprising the following steps: a) making available a heat exchanger arrangement (1) with at least two components which are arranged adjacent to one another in an arra...
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WO/2015/131481A1 |
An adjustable welding tooling for a plastic packaging IPM, comprising a substrate (1), wherein a first groove (2) for accommodating a PCB board (4) and a second groove (3) for accommodating a DBC board (5) are arranged on the substrate (...
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WO/2015/132965A1 |
The present invention is a solder supply apparatus, which comprises a solder cup (70) which contains solder, in fluid form, in the interior of the same and a supply nozzle (74) which is fitted within the solder cup, and which moves the s...
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WO/2015/128080A1 |
The invention relates to a soldering tip fastening sleeve (3) comprising: a soldering device fastening section (7) that has an internal dimension (15) and an external dimension; and a soldering tip fastening section (6) that also has an ...
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WO/2015/129840A1 |
Provided is a glass for an automotive vehicle capable of preventing cracking in glass substrate for an automotive vehicle over time when one surface of a metal terminal is soldered to a silver electrode formed on the glass substrate usin...
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WO/2015/128994A1 |
The present invention is a solder supply device (26) provided with a solder cup (70) containing in the interior thereof solder in fluid form, a positive/negative pressure supply device for changing the pressure within the solder cup in c...
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WO/2015/129034A1 |
Solder is accommodated in a flow tank (20). The solder is discharged from a nozzle (22) by a pump provided in the flow tank (20). A jetting motor (26) for driving the pump is provided on the exterior of the flow tank (20). A cooling devi...
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WO/2015/130353A1 |
A wave solder machine (10) includes a pre-heating station (20), a wave soldering station (22), and a conveyor (16) to transport substrates (12) through a tunnel passing through the pre-heating station (20) and the wave soldering station ...
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WO/2015/128967A1 |
With this solder delivery system, when a determination that a solder cup (70) has been placed in a solder delivery apparatus (26), reading of a barcode by a barcode reader (170) is permitted, whereas when a determination that no solder c...
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WO/2015/112243A1 |
A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a fluxing station configured to apply flux onto the electronic substrate, a pre-heating station configure...
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WO/2015/105089A1 |
Provided is a repair method in which a material that is capable of bonding at a relatively low temperature is used as a repair material in a repair section and a repair that exhibits excellent sealing properties and durability even when ...
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WO/2015/090687A1 |
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a ...
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WO/2015/092877A1 |
A solder supply device (26) for supplying solder inside a solder cup through the tip of a nozzle part by movement of the solder cup, said device being provided with: a solder cup (70) describing a cylindrical shape with an open end, the ...
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WO/2015/090686A1 |
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a ...
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WO/2015/086514A1 |
The present invention relates to a method for applying paste on a surface of elevated portions of a component, an apparatus suitable for carrying out the method and a product manufactured by the method, said method for applying paste ont...
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WO/2015/083272A1 |
A solder supply device (26) comprises: a solder cup (70) in the shape of a tube open at one end; a nozzle portion (88) for discharging solder inside the solder cup to the outside; a flange portion (90) which is disposed fixedly on an out...
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WO/2015/083271A1 |
A solder supply device (26) comprises: a solder cup (70) which is formed in the shape of a tube open at one end and inside which fluid solder is accommodated; a nozzle portion (88) which is inserted into the solder cup, for discharging t...
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WO/2015/079582A1 |
Provided is a substrate joining method that includes the following: a step for causing metal layers (12, 22), that are fff ormed on a plurality of substrates (10, 20) respectively, to face each other with a porous body (32) comprising a ...
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WO/2015/068936A1 |
The present invention relates to an induction heating head and, more particularly, to an induction heating head for melting and supplying a metal material. Specifically, the present invention relates to an induction heating head for loca...
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WO/2015/068147A1 |
Dispenser (1) of soldering wire for soldering pens (30) of the type comprising a pen-like body and a soldering electrode, said dispenser comprising a body shaped so as to rest on the pen body (41) of the soldering pen; an inlet for a wir...
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WO/2015/067413A1 |
The invention relates to a method for repairing a circuit board (1) having at least one defective component (2), which is connected mechanically and/or electrically to the circuit board (1) via at least one contact point (3) on the circu...
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WO/2015/064166A1 |
Provided are a soldering device and a decomposition method with which formic acid can be processed safely and quickly, corrosion of a vacuum pump does not occur, and the exhaust speed and the degree of vacuum in the vacuum chamber can be...
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WO/2015/064143A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. Water vapor that is generated within a separation unit...
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WO/2015/064142A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. This flux recovery device is provided with: a first wa...
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WO/2015/056000A1 |
A fluid applicator (1, 20) applies a fluid, such as flux, to the external surfaces of a pipe (22). The fluid applicator (20) has a fluid reservoir (24) containing the fluid to be applied to a pipe (22), and a fluid carrier (94) to receiv...
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WO/2015/055328A1 |
The invention relates to an apparatus (10) for the individual application of deposits of soldering material, in particular solder balls, comprising a feeding device for the individual feeding of the deposits of soldering material from a ...
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WO/2015/045997A1 |
Provided are a mounting device and a mounting method by which a set temperature profile of a heating means for the purpose of obtaining a desired joining temperature profile during joining can be calculated relatively easily, and which a...
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WO/2015/043780A1 |
The invention relates to an arrangement of at least two solder-wettable separating strips (6, 7) for a soldering nozzle for simultaneously wave soldering rows of solder joints arranged spaced apart. The invention is distinguished by the ...
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WO/2015/044727A2 |
A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.
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WO/2015/039783A1 |
An arrangement (10) for the reproducible application of small amounts of liquid onto a target surface, comprising a liquid reservoir (28, 38) with an opening (24) which can be positioned above the target surface, a plunger (52, 60) which...
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WO/2015/029552A1 |
The present invention is a method for brazing an aluminum alloy material without using flux, characterized in having the objective of forming a joint fillet having adequate joint strength, and in being "a method for brazing in which a me...
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WO/2015/025234A1 |
The invention relates to an application nozzle (1) for flux. The nozzle is beneficially used for soldering ribbons to solar cells and can apply a flux agent to an elongated area on the cell in time parallel. The nozzle (1) uses centrifug...
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WO/2015/015837A1 |
A jet orifice (22) projects a liquid that is supplied from a liquid supply device (1). A nozzle main unit (21) has, in the interior thereof, a passageway (4) which guides the liquid to the jet orifice (22). Air inlets (23) which provide ...
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WO/2015/007255A1 |
The invention relates to a conveyor device for printed circuit boards (4). The conveyor device comprises a carrier means (1) that continuously circulates between conveyor wheels and is linearly guided in some sections. On said carrier me...
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WO/2014/207835A1 |
Provided are a solder ball supplying method, solder ball supplying device, and solder bump forming method that are flux-less and capable of being used for a fine pitch electrode. A substrate (70) that has a resist (74) with an opening (7...
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WO/2014/203499A1 |
The purpose of the present invention is to provide a water vapor reflow device and water vapor reflow method that use superheated water vapor and that make practical use possible. A water vapor reflow device (1) provided with a heating f...
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WO/2014/199694A1 |
The top end (36a) of a return tube (36) is joined to the bottom of a partitioning plate (31) to enclose the entire lower portion of a communicating opening (33). Thus, even when a gas is supplied to a solder reservoir (5), the gas does n...
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WO/2014/194470A1 |
A tin wire transmission apparatus comprises a transmission mechanism (10) and at least one pair of rolling wheels (20) driven by the transmission mechanism (10). A rolling surface of at least one rolling wheel (20) is provided with a gro...
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WO/2014/194475A1 |
A solder-piercing feed wheel. The solder- piercing feed wheel comprises a blade (10) and clamping wheels (20) capable of clamping the blade (10). The number of the clamping wheels (20) is two. Sawtooth-shaped cutter points (11) are dispo...
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WO/2014/194472A1 |
A synchronizing gear transmission mechanism for a soldering machine. The transmission mechanism is a set of gears, and comprises a driving gear (11), a driven gear (12), and a pair of synchronizing gears (13, 13a). The two synchronizing ...
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WO/2014/194468A1 |
A shift lever positioning apparatus for an automatic tin feeding machine comprises a tin feeding mechanism (20). The tin feeding mechanism (20) comprises a shift lever (21), and a reset spring (22) capable of resetting the tin feeding me...
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WO/2014/193006A1 |
The soldering apparatus for applying a solder solution to the antenna coil contacts of a combi-type IC card according to the present invention comprises a solder solution application unit for applying the solder solution to the antenna c...
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WO/2014/175491A1 |
Provided is a runner block having a uniform discharge rate of molten lead, the runner block having horizontal inner and outer conduits in the interior thereof for supplying molten lead, supplied by means of a molten lead inflow conduit, ...
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WO/2014/170963A1 |
Provided is a lead-free solder ball that has excellent optical inspection properties and has a solder ball surface in a uniformly matted state without showing any irregularity caused by the growth of dendrites on the solder ball surface....
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WO/2014/156846A1 |
Provided is a brazing apparatus that uniformly raises the temperature of workpieces by means of a simple structure, and is capable of high-speed brazing. This brazing apparatus (SB) circulates hot nitrogen gas by convection flow inside a...
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