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WO/2017/038282A1 |
To provide a heater chip having an iron part with superior conductivity and heat generating properties, said heater chip being capable of performing processing for bonding conduction wires and terminal members efficiently, stably, and re...
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WO/2017/020564A1 |
A DC heating circuit comprises a triode, a diode, an inductor, a first capacitor, a second capacitor, and a heating wire. A source of the triode is grounded. A drain of the triode is connected to a positive electrode of the diode and one...
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WO/2016/202327A1 |
The invention relates to a calibration method for a bonder, wherein characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during productive operation o...
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WO/2016/192231A1 |
Provided is a preparation method for an alloy material suitable for use in a soldering iron tip. The preparation method comprises the following steps: step 1, taking a copper with a purity of 99.3% or more and an iron with a purity of 99...
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WO/2016/189254A1 |
The present invention relates to a method for manufacturing a titanium aluminide blade of a turbine engine, comprising steps of: (E1) production of a titanium aluminide ingot, (E2) extrusion of the ingot through an opening in a die havin...
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WO/2016/189902A1 |
Provided are a soldering device and a flux applying device that use a nut which is configured such that the nut is attached to the soldering device and the flux applying device and a fixed position of the nut can be changed more easily t...
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WO/2016/187010A1 |
A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adh...
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WO/2016/176865A1 |
Disclosed is a butt welding machine, comprising a machine table, and a clamp device and a welding machine which are provided on the machine table. The clamp device comprises a first chuck device, a second chuck device, at least one biasi...
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WO/2016/169551A1 |
The device according to the invention is used to cool a flat object (2) with a first main surface (200) and a second main surface (202) lying opposite the first main surface in a nonhomogeneous manner. The flat object is cooled from the ...
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WO/2016/153017A1 |
A soldering device (A) comprising a soldering tip (5) which is heatable and which has a substantially cylindrical shape extending vertically, and solder-piece supplying units (2, 6) that supply a solder piece (Wh) from above into the ins...
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WO/2016/148126A1 |
The present invention has a vertically extending heatable iron tip (5) of substantially tubular shape, and a solder piece supply section for causing a first solder piece (Wh1) and a second solder piece (Wh2), which are provided with a la...
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WO/2016/143771A1 |
Bottom surfaces of stepped portions of corrective rings arranged at ends (2) positioned at either side of a barrel (1), and back surfaces of projections of the ends (2) are brought into contact. A control unit (10A) provided to a pressur...
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WO/2016/135634A1 |
A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse- width-modulated (PWM) valve coupled to the variable speed pump; a...
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WO/2016/135891A1 |
This soldering apparatus is provided with: a solder bath (12) for storing a molten solder; a jet nozzle (14) extending upward from the solder bath toward a holding surface (45); a pump (16) that pumps a molten solder (46) stored in the s...
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WO/2016/127715A1 |
A gas floating rotary reflow soldering device, comprising a rotary table (8), a heating plate (14), a limit plate (16), a furnace body, a furnace door (4), a furnace cover, a rotating speed adjustment device (7), a temperature controller...
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WO/2016/126463A1 |
The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the...
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WO/2016/119118A1 |
Disclosed is an electronic module repairing method for repairing a failed electronic module. The electronic module repairing method comprises the following steps: fixedly connecting a suction device with a second bottom plate, so that wh...
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WO/2016/117357A1 |
Provided are: a heat exchanger that suppresses electrical corrosion and makes it possible to strongly fix a plurality of components; and a method for producing said heat exchanger. A plurality of aluminum communication pipes (25a-25j) ar...
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WO/2016/114263A1 |
This soldering iron (1) is designed to melt solder with the distal end (10a), and has an iron tip (10) provided at the basal end (10b) with a first terminal (24), and an iron base (50) housing a second terminal (61) capable of fastening ...
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WO/2016/114275A1 |
In the prior art, as the amount of a fluid discharged by a fluid discharge device becomes more minute, defects occur in which the fluid does not fill in a mask even when discharged. In order for the fluid to fill in a work piece, air in ...
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WO/2016/112375A1 |
The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a ...
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WO/2016/104231A1 |
This soldering device (X) is provided with at least a first soldering iron part and a second soldering iron part, which serve as soldering iron parts, each comprising a substantially cylindrical soldering tips (51) having a supply hole u...
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WO/2016/103526A1 |
A soldering flux includes rosin, a thixotropic agent, an activator, an antioxidant and a solvent, in which rosin ester is included as the rosin, a content of the rosin ester is set in a range of 20 mass% to 50 mass% with respect to the e...
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WO/2016/104710A1 |
Provided is a heating and cooling device which is capable of performing heating and cooling processes within an airtight processing chamber, and which enables size reduction of the device, while increasing the heating and cooling efficie...
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WO/2016/104658A1 |
Provided are a high-sphericity joining member, a solder material, a solder paste, a foam solder, a flux coating material, and a solder joint. This Ni-plated Cu ball 10 is provided with a Cu ball 12, and an Ni plating layer 14 covering th...
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WO/2016/097634A1 |
The present invention relates to a brazing tool (20) for producing a part (30), and in particular to a tool (20) suitable for brazing a set (30) of metal parts, in particular a composite panel, in a chamber of a brazing furnace, the tool...
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WO/2016/091250A1 |
The invention relates to a cooling device for cooling down liquid solder (4) for producing a soldered connection between a first and a second element (2, 3), between which the liquid solder (4) is arranged, wherein the cooling device (1)...
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WO/2016/091962A1 |
The invention relates to a heat transfer device (10, 110, 210) for thermal coupling of a component (28, 128) to be soldered, comprising a heat source and/or a heat sink (48) in a soldering machine (200), having at least one base plate (1...
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WO/2016/075982A1 |
A flux reservoir device (100, 200) includes: a stage (12) having a recess (13) in which flux (51, 52, 53) is reserved; and a flux pot (20), which is a ring-shaped member having a through-hole (30) into which the flux (51, 52, 53) is pour...
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WO/2016/075934A1 |
A soldering correction device provided with: an external-appearance inspection device for inspecting soldering defects relating to a workpiece on which a component is mounted, and storing information about the soldering defect locations;...
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WO/2016/068081A1 |
In the present invention, a joint is formed from a first metal member 2 and a second metal member 3. Brazed joint portions 14, 24, 34, and 44 provided intermittently with a brazing material and solder joints 16, 26, 36, and 46 filling th...
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WO/2016/062978A1 |
The invention relates to a method for producing a final metal part for a nacelle of a turbojet (4), comprising brazing at least two parts, one being an inner part (5) having an inner surface and the other being an outer part (6) having a...
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WO/2016/053078A1 |
The present invention relates to a dross removal apparatus (1) and method to transfer and collect dross or oxidized solder to a collection chamber of a soldering machine therefrom, comprising front declination plate (11), hingable declin...
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WO/2016/047733A1 |
[Solution] A solder tip used to join together a terminal and an electroconductive film formed on a glass substrate, wherein the solder tip has a first surface in surface contact with a surface of the electroconductive film facing the ter...
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WO/2016/044680A1 |
A self-contained speed indicator (10) that can be placed next to a weldment (11) and configured for a desired speed, which then provides a target speed indicator (10) to help a welder (14) practice maintaining that desired speed.
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WO/2016/039057A1 |
A metal paste containing a metal component and a flux is prepared. The metal component is composed of a first metal powder and a second metal powder. The first metal powder is Sn. The second metal powder is a CuNi alloy. Next, the metal ...
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WO/2016/034395A1 |
Disclosed is a hard soldering method wherein an amorphous or partially amorphous hard soldering film having a composition that has a metalloid content of 10 to 30 atomic percent is disposed at a joining point between two or more parts. T...
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WO/2016/028407A1 |
A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station co...
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WO/2016/015188A1 |
A solder-reinforced bonding system comprises a first substrate (110), a second substrate (120) at least partially in contact with a heating element (400), an adhesive (200) in contact with a first contact surface (115) of the first subst...
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WO/2016/017027A1 |
The invention provides a dip flux unit (1) and a squeegee position correcting method capable of improving the accuracy with which a squeegee (2) is positioned. The dip flux unit (1) is provided with the squeegee (2), a squeegee position ...
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WO/2016/018759A1 |
The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) co...
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WO/2016/008941A1 |
The invention relates to a device (10) for the individual application of solder material depots (11), in particular solder balls, said apparatus comprising a conveyor device to convey the solder material depots individually from a solder...
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WO/2015/193684A1 |
A method of forming a solder joint, the method comprising: providing a solder flux; providing solder particles; providing two or more work pieces to be joined; and heating the solder flux and the solder particles in the vicinity of the t...
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WO/2015/185772A1 |
The invention relates to a device and method for controlling the cooling of welded parts. The device comprises: a welding lance; a drum around which a thermal sheet is wound; and an element for securing the thermal sheet to the rear port...
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WO/2015/182331A1 |
A heater control unit (33) reduces power to be supplied to a heater (12) after an integration value of power consumption quantities of the heater (12) exceeds a predetermined threshold value, said power consumption quantities having been...
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WO/2015/182487A1 |
The present invention pertains to a structure for a heater/sensor sub-assembly for a soldering cartridge and solder suction cartridge of a soldering system. This structure provides high heat capacity and accurate soldering-iron-tip-tempe...
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WO/2015/182318A1 |
This heat exchanger tube is provided with: a tube main body configured from an aluminium alloy; and a coating film applied to the surface of the tube main body. The coating film includes a binder, and a mixed power including: at least 1 ...
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WO/2015/174258A1 |
A terminal connection method that comprises: a step for positioning a conductive wire (11) and an earthing terminal (21); a step for winding a composite metal sheet (31), which comprises an Sn powder and a Cu-Ni alloy powder capable of r...
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WO/2015/159784A1 |
A bolt (50) and the threaded portion (61) of a nut (60) are heated. Thus, when a metal paste (10) is heated, first metallic particles (11) are melted. After the heating is completed the first metal cools naturally and solidifies to form ...
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WO/2015/150413A1 |
The invention describes an apparatus (1) and a method for soldering joining partners, in particular electrical components on printed circuit boards or other substrate elements. The joining partners can be received and pressed together be...
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