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WO/2019/099239A1 |
Fuel gas compositions for use in metal fabrication are provided comprising fuel gases comprising a base fuel gas mixed with from about 1% to less than 30% hydrogen.
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WO/2019/098157A1 |
A brazing material (3) is interposed between an aluminium-based material and a Ni-plated iron-based material. The brazing material (3) has a structure in which an Al-Si-Ni-based alloy layer (10) and an Al layer (11) are bonded via a flux...
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WO/2019/094461A1 |
System and methods for solder flux removal from a gas stream is disclosed. In one aspect, the system includes : a scrubber chamber having a gas inlet and a gas outlet through which the gas stream is introduced into and withdrawn from the...
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WO/2019/092947A1 |
[Problem] To provide a car window glass equipped with a lead-free solder joined portion, which passes the VDA test. [Solution] This car window glass comprises: a glass plate having an electrically conductive body layer; a connection term...
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WO/2019/094241A2 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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WO/2019/094036A1 |
A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fractio...
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WO/2019/088222A1 |
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...
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WO/2019/088068A1 |
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...
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WO/2019/085177A1 |
Disclosed are a method and a system for tin immersion and soldering of a core wire. The method for tin immersion and soldering of a core wire comprises: vertically inserting a core wire bank (40) into molten tin (11) to melt the insulati...
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WO/2019/081690A1 |
Aluminum parts, e.g. parts needed for heat exchangers, are brazed using a low flux load, wherein the flux load on the coated areas of the parts is equal to or greater than 1 g/m2 and equal to or lower than 4.5 g/m2. Preferred fluxes comp...
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WO/2019/081218A1 |
A fine-grained structure can be achieved by using an inoculant during cold metal transfer.
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WO/2019/078021A1 |
A soldering apparatus (1) is provided with a jetting unit (12) and a measuring unit (20). The jetting unit (12) includes a nozzle (12a). The measuring unit (20) is configured so as to measure a first surface shape of a diffuse reflection...
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WO/2019/079372A1 |
A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For exa...
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WO/2019/070852A1 |
The present disclosure provides a potassium aluminum fluoride (KAlF?4#191) flux agent having improved properties such as a lower melting point which allows for the use of solders and alloys with lower melting points. The potassium alumin...
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WO/2019/069368A1 |
In this method for joining metal materials, a member (13) made from copper or from a copper alloy is joined to a steel product (11) by a low-melting-point metal joining material (15). Joining strength is improved and vibration and bendin...
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WO/2019/065511A1 |
In the present invention, a horn (32) of an ultrasonic vibration unit (30) extends in a direction intersecting the jet flow direction of solder flowing inside a jetting nozzle (20). A vibration direction converter (35) is provided at the...
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WO/2019/065065A1 |
Provided are a soldering system and a soldering method, whereby solder can be uniformly spread on a to-be-soldered part without damaging a fine soldering target article, and an excellent solder can be achieved. Even after molten solder a...
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WO/2019/058651A1 |
Provided is a method for joining piping that makes it possible to simplify a work procedure, prevent deformation of piping, and minimize increases in costs at the time of joining. In the method for joining piping, first piping 1 is joine...
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WO/2019/058916A1 |
Provided is a joining process line monitoring system with which it is possible to prevent a deterioration in joining quality and work delays. A joining process line monitoring system 100 is provided with: a joining phenomenon data acquir...
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WO/2019/054291A1 |
An etching liquid for active metal brazing materials, which is used for the purpose of etching an active metal brazing material layer that contains Ag, Cu and an active metal. This etching liquid for active metal brazing materials contai...
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WO/2019/044828A1 |
Provided are an electroconductive member joined body and a joining method, in which: the joined body includes a first electroconductive member (W1) that is configured from a first metal (M1), a second electroconductive member (W2) that i...
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WO/2019/044057A1 |
[Problem] To provide a pipe drilling tool for forming, in a pipe, a hole for introducing a non-oxidizing gas such as nitrogen, when joining pipes such as refrigerant pipes by brazing, wherein the pipe drilling tool has a compact configur...
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WO/2019/044830A1 |
Provided are an electroconductive member joined body, a joining method, and a method for optimizing an intermediate member, in which: the joined body includes a first electroconductive member (W1) that is configured from a first metal (M...
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WO/2019/041638A1 |
A solder ball laser welding method, comprising: moving a laser beam of a first power density along a welding track (20) to irradiate a solder ball (10) placed on a bonding pad, so as to soften the solder ball (10), the welding track (20)...
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WO/2019/040284A1 |
The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflo...
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WO/2019/035392A1 |
This electronic component module is provided with a substrate, an electronic component, and a connection device. The substrate has an electrode array. The electronic component has an electrode array. The connection device has: a pluralit...
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WO/2019/031186A1 |
A hydraulic power transmission device wherein a first core-side guide groove, which extends along a direction intersecting the circumferential direction of a core and extends from an end-portion side of a bottom surface part of the core ...
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WO/2019/032485A1 |
A system for the flux free processing of a plurality of solder balls (86) on a wafer (12), comprising: an articulable vacuum support chuck (18) for maintaining support of a plurality of solder balls (86) on a wafer (12) being processed. ...
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WO/2019/031210A1 |
A joined component includes: a first member provided with a first joining surface that has a disposition part whereon a brazing material is disposed; a second member provided with a second joining surface that is braised and joined to th...
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WO/2019/030212A1 |
The aim of the invention is to develop a method for the resistance butt welding of metals, in the case of which metals at least two butt joint surfaces (8, 16) are pressed against each other and the current can subsequently flow through ...
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WO/2019/026915A1 |
Provided is a method for producing a heat exchanger, capable of securely joining flat tubes and fins by brazing. In a brazed layer-forming step, brazed layers (40) are respectively formed on flat tubes (20). In the following temporary as...
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WO/2019/022133A1 |
[Problem] To provide a ceramic circuit board that has high bonding ability and superior thermal cycle resistance. [Solution] According to the present invention, a circuit pattern is provided on a ceramic substrate via a brazing layer, an...
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WO/2019/022193A1 |
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...
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WO/2019/017093A1 |
This heat exchanger is constituted of fins (2), heat transfer tubes (3), and headers (4). These members are joined with each other by brazing. The fins (2), the heat transfer tubes (3), and the headers (4) are assembled and placed on a c...
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WO/2019/013024A1 |
In the present invention, a plate material constituting a tube body part 50 is bent at one end section of the external air flow direction of a first flat wall section 51 toward one side, and is bent at the other end section of the extern...
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WO/2019/011687A1 |
The invention relates to a soldering system and a method for wave soldering, comprising at least one flux nozzle (16) and a device (10) for monitoring a state of a spray jet (12) of said flux nozzle (16).
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WO/2019/011686A1 |
The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, co...
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WO/2019/008003A1 |
The invention relates to a soldering material (1) for active soldering, in particular for active soldering a support layer (2) comprising a metallization (3) on a ceramic, the soldering material comprises copper and essentially does not ...
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WO/2019/009427A1 |
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least tw...
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WO/2019/007873A1 |
Method for operating a soldering device (100) and a soldering device (100), wherein a graphic representation of at least part of the soldering device (100) is captured (212, 304, 404), wherein an instantaneous operating state of the sold...
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WO/2019/007900A1 |
The invention relates to a method for operating a soldering system for selective wave soldering comprising at least solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump be...
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WO/2019/001783A1 |
The invention relates to a method and a device for producing a wire connection between a first contact surface and at least one further contact surface (42), in which a contact end of a wire is positioned by means of a wire guidance tool...
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WO/2018/229122A1 |
A fixation apparatus includes a base, a wire fixing device and a pressing device. The wire fixing device includes a fixing frame fixedly mounted on the base, and a moving unit received in a receiving chamber of the fixing frame and movab...
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WO/2018/230796A1 |
A battery module according to an embodiment of the present invention comprises: a plurality of battery cells, each having an electrode lead; a bus bar formed by connecting a plurality of lead clips to each other, each of the lead clips h...
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WO/2018/225437A1 |
Provides is a soldering device comprising parallel transfer means, in which, even when one transfer means-side of a reflow furnace body is opened, the inside of the reflow furnace body on the other transfer means-side is not exposed. The...
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WO/2018/225477A1 |
This stacked heat exchanger exchanges heat between a refrigerant and an object (4) with which heat is to be exchanged, the object being disposed between a plurality of mutual flow channel pipes (2, 26, 27) stacked in a stacking direction...
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WO/2018/225809A1 |
[Problem] To obtain a ceramic circuit substrate that is suitable for a silver nanoparticle junction in a semiconductor element and has excellent adhesion to a power module sealing resin. [Solution] Provided is a ceramic circuit substrate...
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WO/2018/226219A1 |
Methods (1000) for structural braze repair of damaged industrial machine components, e.g., gas turbine engine components (10). The method includes the step of placing a bilayer braze material (200) onto a surface (12) of the component. T...
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WO/2018/220320A1 |
Heating device (10) suitable for heating at least one solder spot positioned between an electronic component (8) including at least one first pad (8_1) and a printed circuit board (4), the solder spot both rigidly connecting the electron...
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WO/2018/219661A1 |
Method for brazing or refilling a part with micro-interstices, and heat exchanger obtained with such a method. The invention relates to a brazing or refilling method comprising the following steps: - providing at least one part (51) cont...
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