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WO/2020/071357A1 |
This method for producing a bonded structure comprises a reflow step wherein a solder material and a first member are heated within a reflow furnace, while being kept in contact with each other, thereby melting a solder alloy that consti...
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WO/2020/066462A1 |
Provided is a heat exchanger which can be very easily assembled. A heat exchanger (100) is provided with a header (10) which extends in a first direction (dr1), and a plurality of heat transfer pipes (60) which extend in a second directi...
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WO/2020/064291A1 |
The invention relates to a rolled fin stock material from an 3xxx-series aluminium alloy comprising, in wt.%, Mn 0.7% to 2.0%, Si 0.4% to 1.5%, Zn up to 4%, Fe up to 0.8%, Zr 0.02% to 0.40%, Sc 0.01% to 0.6%, Ni up to 0.3%, Cu up to 0.5%...
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WO/2020/058121A1 |
A first aspect of the present invention refers to a method for creating bumps (10), wherein the method comprises: providing a first component (1) having a first metallic surface area (5), creating bumps (10) at the first component (1), w...
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WO/2020/054621A1 |
A sleeve soldering device 10 that solders a terminal 110 of an electronic component in a land 102 provided to a through-hole 101 in a substrate 100, the device 10 comprising: a sleeve 11 that is formed in a tubular shape and heats solder...
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WO/2020/054620A1 |
A sleeve soldering device 10 solders a terminal 110 of an electronic component within a land 102 provided to a through-hole 101 in a substrate 100, wherein the sleeve soldering device 10 comprises a sleeve 11 that is formed in a tubular ...
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WO/2020/054619A1 |
A soldering device 10 for soldering a terminal 110 of an electronic component into a land 102 provided in a through hole 101 in a substrate 100, is provided with auxiliary heat sources 16, 17 that locally heat the land 102 and the termin...
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WO/2020/052622A1 |
Method for welding a joint of a heat exchanger to a connecting pipe, comprising the following steps: forming a diffusion coating on the surface of a joint (10), the corrosion potential of the diffusion coating being less than the corrosi...
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WO/2020/050448A1 |
Provided is a jig assembly comprising: a jig comprising a mounting portion for mounting an object; a first motor connected to the mounting portion and for rotating the mounting portion; and a second motor connected to the jig and for rot...
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WO/2020/050120A1 |
A vehicle window glass assembly according to one embodiment of the present disclosure comprises: a vehicle window glass plate wherein an electroconductive layer containing a prescribed pattern of silver is formed on a principal surface o...
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WO/2020/050535A1 |
An embodiment relates to a motor comprising: a shaft; a rotor coupled to the shaft; and a stator disposed on the outside of the rotor, wherein the stator comprises a stator core, an insulator disposed on the stator core, and a coil wound...
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WO/2020/044520A1 |
A support unit (110) supports members (20) to be joined. A pressing unit (120) presses an attachment member (10) against the members (20) to be joined such that a first solder bump (11A) makes contact with the members (20) to be joined. ...
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WO/2020/047442A1 |
The present application relates to a gas control system and method for a reflow soldering furnace, comprising: an oxygen detecting device, capable of coming into contact with a gas in a furnace chamber, for detecting an oxygen concentrat...
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WO/2020/046959A1 |
Disclosed in the present application is a cooling system for a reflow furnace, the reflow furnace comprising a heating zone, and the cooling system being used to regulate a temperature of the heating zone, the cooling system comprising: ...
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WO/2020/038817A1 |
The invention relates to a method for determining the quality of a welded or soldered connection (4) when welding or soldering hard material bodies (6) to teeth (8) of a saw blade (10), in particular of a band saw blade or a circular saw...
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WO/2020/040733A1 |
A method of repairing an airfoil is provided. The method includes providing an airfoil with a damaged section and removing the damaged section by machining or cutting an upper section of the airfoil. A replacement section is configured t...
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WO/2020/031631A1 |
A cylindrical sputtering target according to the present invention is provided with: a sputtering target material forming a cylindrical shape; and a backing tube joined through a solder layer to the inner circumferential side of the sput...
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WO/2020/027208A1 |
The present invention determines, with high detection performance, abnormalities in jet soldering devices. The present invention comprises: an acquisition unit (421) that acquires a feature value for the imaged jet shape of solder jetted...
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WO/2020/027286A1 |
Provided is an electronic component mounting method comprising a first application step for applying solder cream on an electrode portion provided to at least one among a vertical surface and an inclined surface, each of which is a compo...
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WO/2020/025324A1 |
A method for connecting or joining superalloys is specified. The method comprises a) providing a first part to be joined (1) and a separate second part to be joined (2), wherein the first and second parts to be joined respectively compri...
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WO/2020/026932A1 |
The present invention determines, with high detection performance, abnormalities in jet soldering devices. In the present invention, a controller (40) comprises: an update unit (421) that acquires time series data obtained by quantifying...
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WO/2020/022046A1 |
[Problem] To realize brazing of alumina dispersion strengthened copper. [Solution] GlidCop (registered trademark), which is alumina dispersion strengthened copper, and another metal are prepared, and surfaces thereof to be joined are fin...
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WO/2020/021760A1 |
This method of manufacturing a semiconductor device includes: a step of preparing a second laminate which is obtained by mounting a first laminate on a base substrate via a solder sheet; a step of installing the second laminate inside a ...
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WO/2020/016010A1 |
The invention relates to a device (1) for producing soldered connections on glass panes (GS), • wherein the glass pane (GS) has an electrically conductive layer (AG) on the surface at points to be soldered, wherein a contact (K) to be ...
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WO/2020/016367A1 |
The invention relates to a device (100) for inductively soldering at least one ferromagnetic contact element (14) to at least one conductor structure (3) on a nonmetallic plate (1), comprising: means (11) for fastening a plate (1) during...
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WO/2020/016535A1 |
The invention relates to an assembly method, comprising the following successive steps: a) providing at least two parts (10, 20) made of ceramic materials obtained by sintering non-metallic inorganic powders or a ceramic matrix composite...
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WO/2020/016364A1 |
The invention relates to a soldering tool (13) for inductive soldering, comprising an induction loop (13I) and an induction generator (G), which is electrically connected to the induction loop (13I), wherein the induction loop (13I) cons...
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WO/2020/012226A1 |
The present application concerns an additivated solder paste and a process to apply a reactive additive element for the control of the soldering temperature of electronic components on the reflow soldering method by the use of metallic p...
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WO/2020/007583A1 |
The invention relates to a method for producing a high-temperature-resistant lead-free solder joint (7; 71) between a circuit board (1) and a part (2; 2b), wherein a lead-free solder preform (3; 3b) is used that has a composite material ...
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WO/2020/004184A1 |
This cover member (11) is used by being mounted on a frame body having a recess part in which electronic components are accommodated. The cover member (11) has: a main body part (12); and a bonding part (13) provided in the main body par...
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WO/2020/001976A1 |
The invention relates to a method for producing a panel with at least one electric connection element (2), wherein a) a substrate (7) is provided with an electrically conductive structure (3) on a region of the substrate (7), b) the conn...
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WO/2020/005900A1 |
The present application discloses an end barrier box for blocking ambient gases from entering a hearth of a reflow oven, including: a box body, wherein the box body includes a bottom and a top, the bottom has a mounting bottom plate, the...
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WO/2019/240204A1 |
This method for joining a double pipe is applied to a heat exchanger provided with a double pipe comprising an outer pipe (1) and an inner pipe (2) that are made of an aluminum alloy. The heat exchanger performs heat exchange between a r...
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WO/2019/240203A1 |
This method for joining a double pipe is applied to a heat exchanger provided with a double pipe comprising an outer pipe (1) and an inner pipe (2) that are made of an aluminum alloy. The heat exchanger performs heat exchange between a r...
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WO/2019/240941A1 |
A brazing process using metal carbon alloys for joining ceramics to ceramics, ceramics to metals, and metals to metals. The joined pieces can be used in a wide variety of applications, and can include semiconductor processing equipment p...
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WO/2019/235500A1 |
The present invention relates to a structure having a part in which a surface of a first member and a surface of a second member are brazed to one another, and the objective of the present invention is to prevent brazing filler on an upp...
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WO/2019/233944A1 |
The invention relates to a device (1) for machining workpieces (2) that are difficult to access by means of an imaging beam path (3) and to a corresponding method (100) for laser machining by means of said device (1), said device compris...
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WO/2019/224063A1 |
The invention relates to a brazed heat exchanger incorporating an aluminium alloy baseplate and wherein the baseplate is made from an aluminium alloy having a composition, in wt.%, of:Mn 0.8-1.8, Cu 0.15-1.20, Si 0.25–1.30, Mg 0.10-0.6...
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WO/2019/225514A1 |
This brazing device is equipped with a heating unit configured to heat a brazing material, a detection unit configured to detect a change in the shape of the brazing material which accompanies melting of the brazing material, and a contr...
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WO/2019/216497A1 |
The present invention relates to a method for manufacturing a distributor for an air conditioner, the objective of which is to manufacture a distributor for an air conditioner for inducing a flow of a refrigerant of an air conditioner, b...
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WO/2019/212529A1 |
A weld filler is proposed which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt%): 11.2% - 15.6% chromium (Cr), 9.6% - 11.4% cobalt (Co) 2.4% - 5.0%, molybdenum (Mo) ...
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WO/2019/213059A1 |
Systems for soldering a workpiece;(2) using a solder application system. A nozzle (30) includes a plurality of walls (46, 56) and a floor that together define a nozzle (30) reservoir for containing liquid solder. The plurality of walls (...
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WO/2019/211998A1 |
A soldering nozzle (20) is provided with an outer frame (21), a first partition wall (22a), and a second partition wall (22b). The outer frame (21) includes a flow path (21a) having an opening (OP) through which molten solder (2) is jett...
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WO/2019/207823A1 |
The present invention relates to a silver brazing material in which the essential constituent elements are silver, copper, zinc, manganese, nickel, and tin. The silver brazing material comprises 35 to 45 mass% of silver, 18 to 28 mass% o...
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WO/2019/209070A1 |
The present invention particularly relates to an apparatus (1) for thermally coupling a vehicle heat exchanger. The apparatus (1) is provided with a first holding element (2), a second holding element (3) and one or more heat source (7)....
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WO/2019/207996A1 |
A power module 20 comprises: a semiconductor chip 1; a ceramic substrate 3 that supports the semiconductor chip 1 and is provided with a wiring 3e on an upper surface 3a on which the semiconductor chip 1 is mounted; a solder 2 for joinin...
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WO/2019/208039A1 |
This soldering monitoring device monitors soldering for a workpiece to be soldered (10) which is soldered by molten solder jetted from a jet nozzle after preheating. The soldering monitoring device is provided with: a measurement unit wh...
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WO/2019/204623A1 |
The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow...
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WO/2019/196327A1 |
A nickel brazing production line and process for a plate heat exchanger. The nickel brazing production line for a plate heat exchanger sequentially consists of a roll coater (1), a first tunnel oven (2), a comma coater (3), a second tunn...
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WO/2019/195249A1 |
A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion in...
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