Title:
WORKPIECE-HOLDING JIG, WINDING MACHINE, AND METHOD FOR HOLDING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2021/106800
Kind Code:
A1
Abstract:
A workpiece-holding jig in one aspect of the present disclosure comprises a holding body section and a plurality of wire support sections. The holding body section is formed into a pipe shape having an open end in which a workpiece is positioned. The holding body section is configured so as to hold the workpiece so that a first open end is covered and a second open end is exposed. The plurality of wire support sections are each configured so as to protrude radially inward from the pipe inner surface of the holding body section. The plurality of wire support sections are each configured so as to support a wire wound around the workpiece.
More Like This:
| JP2016028550 | ARMATURE |
| JP2020202647 | INSULATOR FOR PARALLEL WINDING AND WINDING METHOD |
Inventors:
SUMITOMO RYUSUKE (JP)
SUMI MASAHIRO (JP)
SUZUKI DAISUKE (JP)
SUMI MASAHIRO (JP)
SUZUKI DAISUKE (JP)
Application Number:
PCT/JP2020/043459
Publication Date:
June 03, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
BESTEC CO LTD (JP)
International Classes:
H02K15/095; H01F41/04; H01F41/071
Foreign References:
| JP2003164124A | 2003-06-06 | |||
| JP2003169455A | 2003-06-13 | |||
| JP2005051916A | 2005-02-24 | |||
| JP4628052B2 | 2011-02-09 | |||
| JPH07123655A | 1995-05-12 |
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
Download PDF:
Previous Patent: SUBSTRATE TRANSPORT DEVICE AND SUBSTRATE PROCESSING SYSTEM
Next Patent: LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD
Next Patent: LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD