Title:
WIRING AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/079979
Kind Code:
A1
Abstract:
A wiring according to the present disclosure comprises a plurality of divided wirings through which AC current flows. The number of divided wirings is 4 or greater. If Sp denotes the inter-wiring space between two adjacent divided wirings, and Wd denotes the individual wiring width of each of the divided wirings, Sp/Wd is 0.2-0.55 when reverse-phase current is supplied as the AC current through the divided wirings, and Sp/Wd is 0.35-0.95 when in-phase current is supplied as the AC current through the divided wirings.
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Inventors:
OCHIAI YASUHIRO (JP)
Application Number:
PCT/JP2023/029673
Publication Date:
April 18, 2024
Filing Date:
August 17, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01P3/18; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Foreign References:
| JP2000357774A | 2000-12-26 | |||
| JP2011108878A | 2011-06-02 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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