Title:
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BOARD, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2024/075816
Kind Code:
A1
Abstract:
This wiring board comprises a base portion, a dielectric board, and a first signal conductor. The base portion has a first upper surface, a first lower surface, a first side surface, and a first opening portion having an opening in the first upper surface. The dielectric board has a second upper surface, a second lower surface, and a second side surface. Further, the dielectric board is positioned on the first upper surface. The second side surface is positioned along the first side surface. The first signal conductor is positioned on the second upper surface. Further, the first signal conductor includes a first line portion extending in a first direction away from the second side surface, and a first connecting portion positioned between the first line portion and the second side surface. The maximum dimension of the first connecting portion in a second direction along the first side surface is greater than the maximum dimension of the first line portion in the second direction. In a plan view, the first opening portion is positioned overlapping at least a part of the first connecting portion.
Inventors:
KAWAZU YOSHIKI (JP)
Application Number:
PCT/JP2023/036390
Publication Date:
April 11, 2024
Filing Date:
October 05, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/12; H05K1/02
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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