Title:
VOID-CONTAINING POLYESTER-BASED EASY ADHESION FILM
Document Type and Number:
WIPO Patent Application WO/2024/042879
Kind Code:
A1
Abstract:
This void-containing polyester-based easy adhesion film: has a first coating layer B1 that contains a polyester resin containing an inorganic pigment, a void-containing layer A that contains voids therein, and a second coating layer B2 that contains a polyester resin containing an inorganic pigment laminated in this order; has a functional easy adhesion layer on the first coating layer B1; and has an apparent density of 0.80 g/cm3 or greater and 1.20 g/cm3 or less, the void-containing layer A containing a composition that contains a polyester resin, a polypropylene resin, and a silicone resin.
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Inventors:
KUMAGAI EIJI (JP)
OHTA TSUYOSHI (JP)
TAKII ISAO (JP)
NISHIO SHOTARO (JP)
OHTA TSUYOSHI (JP)
TAKII ISAO (JP)
NISHIO SHOTARO (JP)
Application Number:
PCT/JP2023/024899
Publication Date:
February 29, 2024
Filing Date:
July 05, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J7/26; B32B5/18; B32B27/20; B32B27/36; C09J7/24; C09J7/25; C09J7/29
Domestic Patent References:
| WO2022059580A1 | 2022-03-24 |
Foreign References:
| JP2001026089A | 2001-01-30 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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