Title:
ULTRASONIC THINNING DEVICE FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2024/041159
Kind Code:
A1
Abstract:
An ultrasonic thinning device for a wafer, comprising an adsorption unit and a grinding unit. The adsorption unit comprises vacuum suction cups (20) each having a cup body (201); air flow channels (202) and adsorption holes (203) are evenly distributed in the cup body (201); support columns (206) are sealingly and slidably arranged in the adsorption holes (203); and first springs are arranged below the support columns (206). The upper ends of the support columns (206) extend upwards out of the upper surface of the cup body (201); a locking mechanism is arranged in the cup body (201); and when a wafer is attached to the upper surface of the cup body (201), the locking mechanism locks the support columns (206) and communicates the adsorption holes (203) with the air flow channels (202) so that a vacuumizer maintains adsorption of the wafer. The grinding unit is provided with an air bearing spindle, and comprises a transmission shaft assembly, a driving apparatus, a grinding assembly, an ultrasonic vibration assembly, and a shock isolation assembly (50) for transmitting torque of the transmission shaft assembly to the grinding assembly and preventing the transmission shaft assembly from vibrating. The wafer can be effectively prevented from deformation and breakage due to adsorption, thereby improving the surface quality of the wafer after grinding.
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Inventors:
LIU QUANYI (CN)
Application Number:
PCT/CN2023/102469
Publication Date:
February 29, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
SHENZHEN EVERWIN PRECISION TECH CO LTD (CN)
SHENZHEN DREAM LAUNCH SEMICONDUCTOR EQUIPMENT CO LTD (CN)
SHENZHEN DREAM LAUNCH SEMICONDUCTOR EQUIPMENT CO LTD (CN)
International Classes:
B24B41/047; B24B7/22; B24B37/10; B24B37/30; H01L21/683
Foreign References:
| CN218427642U | 2023-02-03 | |||
| CN115383618A | 2022-11-25 | |||
| CN115194648A | 2022-10-18 | |||
| CN113910072A | 2022-01-11 | |||
| CN214080891U | 2021-08-31 | |||
| CN102593035A | 2012-07-18 | |||
| CN108380910A | 2018-08-10 | |||
| CN110571183A | 2019-12-13 | |||
| CN112743452A | 2021-05-04 | |||
| TW202209469A | 2022-03-01 |
Attorney, Agent or Firm:
CHONGQING LETAI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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