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Patent Searching and Data


Title:
TITANIUM TARGET FOR SPUTTERING
Document Type and Number:
WIPO Patent Application WO/2013/105283
Kind Code:
A1
Abstract:
A titanium target for sputtering, which is a high-purity titanium target characterized by containing 0.5 to 5 ppm by mass of S as an additive component, wherein the purity of the target excluding the additive component and a gaseous component is 99.995 mass% or more. The purpose is to provide a high-quality titanium target for sputtering, which does not undergo cracking or breaking during high-power sputtering (high-speed sputtering) and can have stabilized sputtering properties.

Inventors:
TSUKAMOTO SHIRO (JP)
MAKINO NOBUHITO (JP)
FUKUSHIMA ATSUSHI (JP)
YAGI KAZUTO (JP)
HINO EIJI (JP)
Application Number:
PCT/JP2012/061412
Publication Date:
July 18, 2013
Filing Date:
April 27, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
TSUKAMOTO SHIRO (JP)
MAKINO NOBUHITO (JP)
FUKUSHIMA ATSUSHI (JP)
YAGI KAZUTO (JP)
HINO EIJI (JP)
International Classes:
C23C14/34; C22B34/12; C22C14/00
Domestic Patent References:
WO2012057057A12012-05-03
WO2001038598A12001-05-31
Foreign References:
JP2010235998A2010-10-21
JP2001509548A2001-07-24
JP2012067386A2012-04-05
JP2001509548A2001-07-24
JP2010235998A2010-10-21
Other References:
See also references of EP 2738285A4
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
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Claims: