Title:
THIN FILM THICKNESS MEASURING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/191271
Kind Code:
A1
Abstract:
Provided are a thick film thickness measuring apparatus and method, whereby the limitations on measurement of an ultrasonic signal reflected when measuring the thickness of a thin film by using retroreflection of ultrasonic waves can be overcome. The thin film thickness measuring apparatus comprises an ultrasonic retroreflector that is provided under a test object formed in the form of a thin film and retroreflects ultrasonic waves incident through the test object; an ultrasonic wave incidence portion provided at one side of the test object to allow ultrasonic waves to be incident on one surface of the test object; and a measuring unit which is connected to the ultrasonic incidence portion and measures the arrival time of the ultrasonic waves reflected through the test object.
Inventors:
LEE JESEUNG (KR)
PARK JOOA (KR)
KIM YOON YOUNG (KR)
PARK JOOA (KR)
KIM YOON YOUNG (KR)
Application Number:
PCT/KR2023/000583
Publication Date:
October 05, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
SEOUL NAT UNIV R&DB FOUNDATION (KR)
CT ADVANCED META MAT (KR)
CT ADVANCED META MAT (KR)
International Classes:
G01B17/02; G01N29/07
Foreign References:
| JP2014507643A | 2014-03-27 | |||
| US20130192374A1 | 2013-08-01 | |||
| JPH09280848A | 1997-10-31 | |||
| US20180112973A1 | 2018-04-26 | |||
| JP2012141211A | 2012-07-26 | |||
| EP0676629B1 | 2002-02-20 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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