Title:
THIN FILM POLYMER LAMINATED CAPACITOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/014457
Kind Code:
A1
Abstract:
The present invention pertains to a thin film polymer laminated capacitor having a structure in which a resin thin film layer and an internal electrode metal layer are alternately laminated. The resin thin film layer has a high molecular weight structure obtained through polymerization of a first monomer which is a polyfunctional monomer and a second monomer which is a monofunctional monomer. The first monomer and the second monomer satisfy at least one of conditions (a) and (b). (a) The HLB value H2 of the second monomer is less than the HLB value H1 of the first monomer.
(b) By using the following manufacturing method (1), when a first polymer member formed by using only the first monomer as the monomer and a second polymer member formed by using only the second monomer as the monomer are manufactured, and the water absorption rate of each of the polymer members is measured after being left still at 40℃ for 40 hours at 95%-relative humidity, the water absorption rate of the second polymer member is lower than the water absorption rate of the first polymer member. Here, the manufacturing method (1) comprises: providing the first monomer or the second monomer as a test monomer; obtaining a mixture by mixing a photoinitiator at a proportion of 0.2±0.01 mol with respect to 100 mol of the test monomer; pouring the mixture in a round plate; and creating a disc shaped polymer member having a dimension of diameter 30 mm × depth 1 mm, by irradiating, with UV, the mixture poured in the round plate in a nitrogen atmosphere at 120 W and from a distance of 250 mm until progress of polymerization stops.
Inventors:
KANAI TOSHIHITO (JP)
HAYAKAWA ARINA (JP)
KAKO TOMONAO (JP)
HAYAKAWA ARINA (JP)
KAKO TOMONAO (JP)
Application Number:
PCT/JP2023/025579
Publication Date:
January 18, 2024
Filing Date:
July 11, 2023
Export Citation:
Assignee:
RUBYCON CORP (JP)
International Classes:
H01G4/30; C08F220/18; H01G4/14; H01G4/18; H01G4/33
Domestic Patent References:
| WO2015118693A1 | 2015-08-13 |
Foreign References:
| JP2021019133A | 2021-02-15 | |||
| JP2017033966A | 2017-02-09 | |||
| JP2000216049A | 2000-08-04 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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