Title:
THERMOSETTING CONDUCTIVE RESIN COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/080027
Kind Code:
A1
Abstract:
The present invention provides a thermosetting conductive resin composition which contains a conductive powder and a resin binder, wherein: the conductive powder contains a flake conductive powder; the resin binder contains a thermosetting silicone resin having a hydroxyl group; and 25.0% by mass or more of the resin binder is composed of the thermosetting silicone resin having a hydroxyl group. Consequently, the present invention is able to provide a thermosetting conductive resin composition which is capable of forming a conductive resin layer that has high moisture resistance and excellent electrical conductivity even in cases where a plurality of kinds of resins including a silicone resin are used as the resin binder.
Inventors:
ESAKI SOICHIRO (JP)
Application Number:
PCT/JP2022/039885
Publication Date:
May 11, 2023
Filing Date:
October 26, 2022
Export Citation:
Assignee:
SHOEI CHEMICAL IND CO (JP)
International Classes:
C08L83/06; C08K3/08; C08K7/00; C08L101/00
Domestic Patent References:
| WO2019155846A1 | 2019-08-15 | |||
| WO2016031551A1 | 2016-03-03 | |||
| WO2009144925A1 | 2009-12-03 |
Foreign References:
| JP2015537068A | 2015-12-24 | |||
| JPS63117065A | 1988-05-21 | |||
| JP2020193241A | 2020-12-03 | |||
| US20160042864A1 | 2016-02-11 | |||
| JP2014135463A | 2014-07-24 | |||
| JPS6331522B2 | 1988-06-24 |
Attorney, Agent or Firm:
ASHITABA INTERNATIONAL PATENT OFFICE (JP)
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