Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2022/209786
Kind Code:
A1
Abstract:
A thermoelectric conversion module (1) is provided with: a pair of support substrates arranged opposing each other and comprising an upper substrate (10) and a lower substrate (20) each having a resin base material (11, 21) and a first metal layer (12, 22) disposed on one surface side of the resin base material (11, 21); a thermoelectric conversion element (30) disposed between the upper substrate (10) and the lower substrate (20); and an insulating layer (70) covering the first metal layer (22) of the lower substrate (20). At least a part of the thermoelectric conversion element (30) is positioned on the insulating layer (70). The insulating layer (70) has an opening (71) exposing at least a part of the first metal layer (22). The thermoelectric conversion element (30) and the first metal layer (22) exposed from the opening (71) are electrically connected via a solder (90) formed in the opening (71).
Inventors:
SAITOU YUI
YAMAMOTO MASUMI
YAMAMOTO MASUMI
Application Number:
PCT/JP2022/011059
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L35/08; H02N11/00
Domestic Patent References:
| WO2020071036A1 | 2020-04-09 |
Foreign References:
| JP2010027840A | 2010-02-04 | |||
| JP2016127219A | 2016-07-11 | |||
| JP2015188026A | 2015-10-29 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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