Title:
THERMALLY CONDUCTIVE TWO-COMPONENT ADDITION CURING TYPE SILICONE COMPOSITION, CURED PRODUCT, AND SHEET
Document Type and Number:
WIPO Patent Application WO/2024/024503
Kind Code:
A1
Abstract:
Provided is a thermally conductive two-component addition curing type silicone composition that can suppress corrosion of metal wirings formed of copper and a copper alloy. This thermally conductive two-component addition curing type silicone composition comprises: a first liquid containing (A) an organopolysiloxane having at least two alkenyl groups bound to silicon atoms, (C) a thermally conductive filler, and (E) a platinum group catalyst for hydrosilylation reaction; and a second liquid containing (A) the organopolysiloxane having at least two alkenyl groups bound to silicon atoms, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bound to silicon atoms, (C) the thermally conductive filler, and (D) a benzotriazole derivative represented by general formula (1) (in the formula, each R1 independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1-6 carbon atoms, and R2 represents a hydrogen atom or a monovalent organic group).
Inventors:
TABATA YUJI (JP)
IWATA MITSUHIRO (JP)
TSUKADA JUNICHI (JP)
IWATA MITSUHIRO (JP)
TSUKADA JUNICHI (JP)
Application Number:
PCT/JP2023/025649
Publication Date:
February 01, 2024
Filing Date:
July 12, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/013; C08K5/3475; C08K5/5455; C08L83/05; C09K5/14; H01L23/373
Domestic Patent References:
| WO2018079309A1 | 2018-05-03 |
Foreign References:
| JP2020063380A | 2020-04-23 | |||
| JP2020041024A | 2020-03-19 | |||
| JP2021187877A | 2021-12-13 | |||
| JP2019031601A | 2019-02-28 | |||
| JP2006056986A | 2006-03-02 | |||
| JPH02242854A | 1990-09-27 | |||
| JP2002235184A | 2002-08-23 | |||
| JP2011012251A | 2011-01-20 | |||
| JP2015151617A | 2015-08-24 | |||
| JP2014177612A | 2014-09-25 | |||
| JPS63234013A | 1988-09-29 | |||
| JP2022185620A | 2022-12-15 |
Attorney, Agent or Firm:
USHIKI & ASSOCIATES (JP)
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