Title:
THERMALLY CONDUCTIVE RING FOR A WHEEL ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2010/128828
Kind Code:
A1
Abstract:
According to the present invention, a thermally conductive ring for a wheel assembly, which is inserted over a stud bolt that fixes a brake drum or disc of a vehicle to a wheel, is provided with a cylindrical main body having a cutaway portion in the lengthwise direction, and a heat-dissipating portion formed on at least one side of a surface and edge of the main body to increase the surface area. The thermally conductive ring of a wheel assembly facilitates the transfer of heat generated during braking and driving to the wheels and enables heat dissipation, to retain the initial design specifications of the vehicle while reducing the uneven wear of tires and uneven braking, and improving cornering and ride quality.
Inventors:
YOON SUNG KYUN (KR)
Application Number:
PCT/KR2010/002931
Publication Date:
November 11, 2010
Filing Date:
May 07, 2010
Export Citation:
Assignee:
YON MOTORS CO LTD (KR)
YOON SUNG KYUN (KR)
YOON SUNG KYUN (KR)
International Classes:
B60B3/16; B60B3/14; F16B43/00
Foreign References:
| KR200374199Y1 | 2005-01-25 | |||
| JP2003314601A | 2003-11-06 | |||
| JPS5499203U | 1979-07-13 | |||
| JP2007023832A | 2007-02-01 | |||
| KR20050081140A | 2005-08-18 |
Attorney, Agent or Firm:
LEE, Jea Ryang (KR)
이재량 (KR)
이재량 (KR)
Download PDF: