Title:
THERMAL PROTECTOR
Document Type and Number:
WIPO Patent Application WO/2008/053575
Kind Code:
A1
Abstract:
In a thermal protector which can conduct a large current by minimizing the impact
by heat generation incident to energizing as much as possible, the rear end of
a movable plate (28) is secured to one end of a resin base (17) and a pair of terminals
(16a, 16b) for connection with an external circuit are secured to the other end
thereof. Fixed contacts (18a, 18b) are formed at the fixed portions of the terminals
(16a, 16b), and the movable contact (21) of the movable plate (28) is arranged
oppositely to the fixed contacts (18a, 18b). A bimetal element (27) engaging
with the central portion of the movable plate (28) is set to project upward at normal
temperature thus bringing the movable contact (21) into pressure contact with
the fixed contact (18) with a predetermined contact pressure. The bimetal element
(27) consists of an inversion region (27-1) entirely, and, since the inversion
region (27-1) has no portion overlapping the conduction path region (16-1) of
a load current shown by arrows (a, b, c, d, and e) in an arrangement space in a housing
(not shown) of the thermal protector, it is not affected by Joule's heat
from the conduction path.
Inventors:
TAKEDA HIDEAKI (JP)
Application Number:
PCT/JP2007/000208
Publication Date:
May 08, 2008
Filing Date:
March 12, 2007
Export Citation:
Assignee:
UCHIYA THERMOSTAT (JP)
TAKEDA HIDEAKI (JP)
TAKEDA HIDEAKI (JP)
International Classes:
H01H37/54
Foreign References:
| JPH11260221A | 1999-09-24 | |||
| JPS56110543U | 1981-08-26 |
Attorney, Agent or Firm:
OSUGA, Yoshiyuki (Nibancho Bldg.8-20, Nibancho,Chiyoda-ku, Tokyo, JP)
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