Title:
THERMAL INSULATION SHEET, AND POWER SUPPLY DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2021/251017
Kind Code:
A1
Abstract:
The present invention enables the suppression of hot spot generation while also maintaining thermal insulation performance. A thermal insulation sheet (10) comprises: an intermediate layer (11); and a surface layer (12) layered on the surface of the intermediate layer (11). The thermal conductivity in the thickness direction of the intermediate layer is 0.50 W/m·K or less; the thermal conductivity in the thickness direction of the surface layer is 1.00 W/m·K or more; and the thermal conductivity in the surface direction of the surface layer is five or more times the thermal conductivity in the thickness direction. Due to this configuration, an insulating sheet has a multilayer structure in which the surface layer (12) serves as a heat-dissipating layer with enhanced thermal conductivity and the intermediate layer (11) serves as a heat-insulating layer with enhanced thermal insulation properties. With the surface layer (12) on the thermal-insulation object side, the generation of hot spots can be suppressed through high heat dissipation performance, while the intermediate layer (11) with enhanced thermal insulation performance is placed on the back side to prevent thermal conduction to other adjacent components, thus preventing burning from spreading heat.
Inventors:
CHIBA HIROFUMI (JP)
Application Number:
PCT/JP2021/016674
Publication Date:
December 16, 2021
Filing Date:
April 26, 2021
Export Citation:
Assignee:
AWA PAPER & TECH COMPANY INC (JP)
International Classes:
B32B7/027; F16L59/02; H01M10/651; H01M10/6551; H01M10/658; H01M10/613; H01M10/625; H01M10/647
Domestic Patent References:
| WO2019150939A1 | 2019-08-08 |
Foreign References:
| JP2011108617A | 2011-06-02 | |||
| JP2019147357A | 2019-09-05 | |||
| JP2015211013A | 2015-11-24 |
Attorney, Agent or Firm:
FUJIWARA Hisae et al. (JP)
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