Title:
TESTING DEVICE AND TESTING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/062635
Kind Code:
A1
Abstract:
A testing device according to the present invention comprises: an acquisition unit that acquires a plurality of pieces of image data by capturing an image of a test area of at least a portion of a substrate a number of times that corresponds to the progress of prescribed substrate work on the substrate; and a determination unit that determines the state of the test area by comparing reference image data that is image data acquired at a first work machine that applies a joining member to the test area as substrate work with test image data that is image data acquired at a second work machine that mounts a component at the test area as substrate work.
Inventors:
KAWAI HIDETOSHI (JP)
Application Number:
PCT/JP2022/035550
Publication Date:
March 28, 2024
Filing Date:
September 23, 2022
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K3/34; H05K13/08
Foreign References:
JP2008258519A | 2008-10-23 | |||
JP2014038045A | 2014-02-27 | |||
JP2006242719A | 2006-09-14 | |||
JP2005303269A | 2005-10-27 | |||
JP2018207023A | 2018-12-27 | |||
JP2013069889A | 2013-04-18 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
Download PDF:
Previous Patent: SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING DEVICE,...
Next Patent: ELECTRIC SCALPEL
Next Patent: ELECTRIC SCALPEL