TEMPLATE SUBSTRATE, METHOD AND EQUIPMENT FOR MANUFACTURING SAME, SEMICONDUCTOR SUBSTRATE, AND METHOD AND EQUIPMENT FOR MANUFACTURING SAME

Title:

TEMPLATE SUBSTRATE, METHOD AND EQUIPMENT FOR MANUFACTURING SAME, SEMICONDUCTOR SUBSTRATE, AND METHOD AND EQUIPMENT FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2022/181584

Kind Code:

A1

Abstract:

A template substrate (7) including: a main substrate including an edge (E), a peripheral section (1S) including the edge, and a non-peripheral section (1P) located on the inside of the peripheral section; and a mask pattern located above the main substrate, wherein the mask pattern includes a mask section (5), a plurality of first openings (KF) having a width direction as a first direction and a longitudinal direction as a second direction, and overlapping the non-peripheral section (1P) in a plan view, and one or more second openings (KB) arranged along the edge in a plan view.

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Inventors:

KAMIKAWA TAKESHI (JP)

Application Number:

PCT/JP2022/007132

Publication Date:

September 01, 2022

Filing Date:

February 22, 2022

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01L33/32; H01L21/20; H01L21/205

Domestic Patent References:

WO2018030311A1

2018-02-15

Foreign References:

US20170263440A1	2017-09-14
JP2000294827A	2000-10-20
JP2012134243A	2012-07-12
JP2011066390A	2011-03-31
JP2014111527A	2014-06-19

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK (JP)

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