Title:
TEMPLATE ASSEMBLY, POLISHING HEAD, AND POLISHING METHOD OF WAFER
Document Type and Number:
WIPO Patent Application WO/2023/095503
Kind Code:
A1
Abstract:
The present invention relates to a wafer-supporting template assembly used for polishing one surface of a wafer, the template assembly being provided with: a back pad; and a guide ring part fixed along the outer peripheral part of the back pad, wherein the back pad has a PV value of a radial shape profile in a surface supporting the wafer of at most 0.9 mm, and a surface roughness Ra of the surface supporting the wafer of at most 1.1 μm. Thus, provided is the template assembly which can improve the in-plane uniformity of the edge flatness of the wafer after polishing one surface thereof.
Inventors:
SUZUKI KENTA (JP)
Application Number:
PCT/JP2022/039255
Publication Date:
June 01, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/30; B24B37/10; B24B37/32; H01L21/304
Foreign References:
| JP2019155578A | 2019-09-19 | |||
| JP2020028930A | 2020-02-27 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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