SYSTEM FOR MANUFACTURING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

WIPO Patent Application WO/2022/270052

A1

Provided is a system for manufacturing an electronic component, the system enabling efficient distribution of electronic components according to a processing status of the electronic components.　This system 1 for manufacturing an electronic component 10 by performing a plurality of manufacturing steps comprises: a plurality of manufacturing facilities 20 for executing, on the electronic component 10, different processes corresponding to each of the plurality of manufacturing steps; a distribution mechanism 30 for distributing electronic components 10 to the manufacturing facilities 20; and a control unit 100. The control unit 100 registers a plurality of electronic components 10 as a batch, associates batch identification information pertaining to the registered batch and process information indicating the processes executed by the manufacturing facilities 20 to generate status information pertaining to the batch, and, on the basis of the generated status information pertaining to the batch, outputs, to the distribution mechanism 30, an instruction signal to distribute the registered batch to prescribed manufacturing facilities 20.

IRIE TSUNEMASA (JP)
MIKAMI KAZUHIRO (JP)
SAKAI SATOKI (JP)

PCT/JP2022/012065

December 29, 2022

March 16, 2022

Click for automatic bibliography generation  

MURATA MANUFACTURING CO (JP)

G05B19/418; H01C17/00; H01F41/00; H01G4/30; H01G13/00

JPH04316156A	1992-11-06
JP2014003145A	2014-01-09

KATO Ryuta et al. (JP)

View/Download PDF      PDF Help

Previous Patent: BONDING WIRE FOR SEMICONDUCTOR DEVICE

Next Patent: HOT-DIP GALVANIZED STEEL SHEET AND METHOD FOR PRODUCING SAME, AND MEMBER