SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

Title:

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2022/145779

Kind Code:

A1

Abstract:

A surface-treated copper foil according to exemplary embodiments comprises a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed in the protrusion layer or around the boundary between the copper foil layer and the protrusion layer. Abnormal growth of protrusions can be prevented through the pores and thus the bonding strength with an insulating layer can be enhanced.

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Inventors:

YOO IL HWAN (KR)
JUNG JOO YOUNG (KR)
KYUN MYUNG OK (KR)
RYU JI YEON (KR)
OH SEUNG BAE (KR)

Application Number:

PCT/KR2021/018342

Publication Date:

July 07, 2022

Filing Date:

December 06, 2021

Export Citation:

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Assignee:

SKC CO LTD (KR)

International Classes:

C25D5/00; C25D1/04; H05K1/09; H05K3/38

Foreign References:

KR20060041689A	2006-05-12
KR20180109364A	2018-10-08
JP2005048277A	2005-02-24
JP2010114093A	2010-05-20
CN106103082A	2016-11-09

Attorney, Agent or Firm:

LEECHAE INTELLECTUAL PROPERTY (KR)

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