Title:
SUPERCONDUCTING WIRE MATERIAL CONNECTION STRUCTURE, AND LAYERED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/075481
Kind Code:
A1
Abstract:
This superconducting wire material connection structure is equipped with: a first superconducting wire material which has a first substrate, a first intermediate layer positioned on the first substrate, and a first superconducting layer positioned on the first intermediate layer; and a second superconducting wire material which has a second substrate, a second intermediate layer positioned on the second substrate, and a second superconducting layer positioned on the second intermediate layer. The first superconducting wire material has a first end surface, which is an end surface of the first superconducting wire material in the lengthwise direction. The second superconducting wire material has a second end surface, which is an end surface of the second superconducting wire material in the lengthwise direction. As a result of joining the first end surface and the second end surface to one another, the first superconducting wire material is connected to the second superconducting wire material in a manner such that the first substrate, the first intermediate layer and the first superconducting layer respectively face the second substrate, the second intermediate layer and the second superconducting layer.
Inventors:
ITO TOMOHIRO (JP)
OHKI KOTARO (JP)
OHKI KOTARO (JP)
Application Number:
PCT/JP2023/033294
Publication Date:
April 11, 2024
Filing Date:
September 13, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R4/68; H01B12/06
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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