Title:
SUBSTRATE WITH SILICA FILM
Document Type and Number:
WIPO Patent Application WO/2024/029537
Kind Code:
A1
Abstract:
The present invention provides a substrate with a silica film, which has excellent initial oil repellency, while having improved oil repellency after being heated to 300°C. A substrate with a silica film according to the present invention comprises a substrate and a silica film that is arranged on the substrate; the silica film contains an antioxidant and a hydrolysis condensation product of a hydrolyzable compound that contains a compound represented by Si(-R1)n(-OR2)4-n; the content of the antioxidant is 25% by mass or less relative to the total mass of the silica film; and the ratio of the carbon atom content to the silicon atom content in the silica film is 0.90 or more; and the thickness of the silica film is 15 nm or more. In the formula, R1 represents an alkyl group having 1 to 3 carbon atoms; R2 represents a methyl group or an ethyl group; and n represents an integer of 1 to 3.
Inventors:
ABE SAYAKA (JP)
Application Number:
PCT/JP2023/028164
Publication Date:
February 08, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B9/00; C09D1/00; C09D7/61; C09D183/00
Domestic Patent References:
| WO2018070426A1 | 2018-04-19 | |||
| WO2019035271A1 | 2019-02-21 |
Foreign References:
| JP2000129145A | 2000-05-09 | |||
| JPH09194731A | 1997-07-29 | |||
| JPH1149970A | 1999-02-23 | |||
| JP2010197559A | 2010-09-09 | |||
| JP2021160225A | 2021-10-11 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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