Title:
SUBSTRATE TREATMENT SYSTEM AND EDGE RING ATTACHMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075423
Kind Code:
A1
Abstract:
Provided is a substrate treatment system comprising a plasma treatment device, a reduced pressure transfer device that is connected to the plasma treatment device, and a control device. The plasma treatment device has: a treatment container that is configured such that the pressure thereof can be reduced; a substrate support base that is provided inside the treatment container, that includes a substrate placement surface, a ring placement surface on which an edge ring is placed so as to surround the substrate, and an electrostatic chuck which electrostatically clamps the edge ring to the ring placement surface, and that is connected to a power source which supplies direct current voltage in pulses for bias; a raising/lowering mechanism that raises and lowers the edge ring; and a plasma generation unit that generates plasma in the treatment container. The reduced pressure transfer device has a transfer robot that transfers the edge ring. The control device controls: a step for lowering, with the raising/lowering mechanism, the edge ring that has been transferred in the treatment container by the transfer robot and received by the raising/lowering mechanism, and placing the edge ring on the ring placement surface; a step for electrostatically clamping, to the ring placement surface, the edge ring that has been placed; and a step for generating plasma in the treatment container prior to plasma treatment of the substrate and stabilizing the electrostatically clamping of the edge ring to the electrostatic chuck. The stabilizing step includes a step for applying, to the substrate support base, the direct current voltage in pulses for bias. The step for applying the direct current voltage includes a first step for applying a first bias voltage and a second step for applying a second bias voltage that is higher than the first bias voltage after the first step.
Inventors:
ARAMAKI TAKASHI (JP)
LI LIFU (JP)
SASAKI NOBUTAKA (JP)
AKAMA TOSHIKI (JP)
KATO SHUSEI (JP)
PARK GYEONG MIN (JP)
SHIMIZU WATARU (JP)
KOITABASHI RYOTA (JP)
LI LIFU (JP)
SASAKI NOBUTAKA (JP)
AKAMA TOSHIKI (JP)
KATO SHUSEI (JP)
PARK GYEONG MIN (JP)
SHIMIZU WATARU (JP)
KOITABASHI RYOTA (JP)
Application Number:
PCT/JP2023/030543
Publication Date:
April 11, 2024
Filing Date:
August 24, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; B65G49/07; H01L21/677; H01L21/683
Foreign References:
| JP2022111771A | 2022-08-01 | |||
| JP2022148699A | 2022-10-06 | |||
| JP2021141308A | 2021-09-16 | |||
| JP2018010992A | 2018-01-18 | |||
| JP2001057363A | 2001-02-27 | |||
| JP2011009351A | 2011-01-13 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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