Title:
SUBSTRATE TREATMENT DEVICE, SUBSTRATE SUPPORTING TOOL, SUBSTRATE TREATMENT METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2024/034172
Kind Code:
A1
Abstract:
The present invention provides a technology capable of improving uniformity among substrates in substrate treatment. The present invention comprises: a substrate supporting tool having a treatment region in which substrates are placed, wherein a plurality of placement parts is disposed in the substrate supporting tool, and the substrates are placed on the placement parts such that the distance between substrates in an upper region and a lower region in the treatment region is narrower than the distance between substrates in a central region of the treatment region; a treatment container accommodating the substrate supporting tool; a gas supply part supplying a treatment gas into the treatment container; and an exhaust part exhausting the atmosphere inside the treatment container.
Inventors:
OGAWA ARITO (JP)
Application Number:
PCT/JP2023/011299
Publication Date:
February 15, 2024
Filing Date:
March 22, 2023
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
C23C16/458; C23C16/455; H01L21/683
Domestic Patent References:
| WO2021186677A1 | 2021-09-23 |
Foreign References:
| JP2004221227A | 2004-08-05 | |||
| JP2012004408A | 2012-01-05 | |||
| JP2004047767A | 2004-02-12 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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