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Patent Searching and Data


Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/045629
Kind Code:
A1
Abstract:
The present invention relates to a substrate treatment apparatus and, more specifically, to a substrate treatment apparatus for depositing a thin film on a substrate. A substrate treatment apparatus according to an embodiment of the present invention comprises: a plurality of material gas supply parts for supplying a plurality of material gases in which at least one of the plurality of material gases comprises (3-dimethylaminopropyl)dimethylindium (DADI); a gas mixing part to which the plurality of material gas supply parts are connected, and which has an inner space so that a passing speed is lower than the feed speed of the plurality of material gases; and a chamber connected to the gas mixing part, and having a reaction space in which material gases that have been mixed in the inner space are provided.

Inventors:
KIM DUCK HO (KR)
KOO HYUN HO (KR)
MHA CHANG SU (KR)
PARK AE JUNG (KR)
LEE SANG DU (KR)
CHAE MIN SEOK (KR)
Application Number:
PCT/KR2021/010455
Publication Date:
March 03, 2022
Filing Date:
August 06, 2021
Export Citation:
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Assignee:
JUSUNG ENG CO LTD (KR)
International Classes:
C23C16/40; C23C16/455; C23C16/448; H01L21/02
Foreign References:
KR20190098533A2019-08-22
JP2013518989A2013-05-23
JP2001234348A2001-08-31
JP2009129963A2009-06-11
KR20130024296A2013-03-08
Attorney, Agent or Firm:
NAM, Seung-Hee (KR)
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