Title:
SUBSTRATE SUPPORT DEVICE AND PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120426
Kind Code:
A1
Abstract:
Provided are a substrate support device and a plasma processing device with which an edge ring is placed on an electrostatic chuck with favorable positional accuracy. A substrate support device comprises: a base; a first electrostatic chuck region that is provided at the top of the base, that has a substrate support surface, and that is configured to hold a substrate atop the substrate support surface; and a second electrostatic chuck region that is provided at the top of the base, that is provided so as to surround the first electrostatic chuck region, that has a ring support surface, and that is configured to hold an edge ring atop the ring support surface. The second electrostatic chuck region is provided with a locating pin for the edge ring, the pin being formed of a material having a coefficient of linear expansion substantially equal to that of a material forming the second electrostatic chuck region.
Inventors:
TAMURA HAJIME (JP)
Application Number:
PCT/JP2022/046432
Publication Date:
June 29, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; H01L21/3065; H02N13/00
Domestic Patent References:
| WO2011039881A1 | 2011-04-07 | |||
| WO2019088204A1 | 2019-05-09 |
Foreign References:
| JP2020043137A | 2020-03-19 | |||
| JP2013125823A | 2013-06-24 | |||
| JP2011054933A | 2011-03-17 | |||
| JP2001525997A | 2001-12-11 | |||
| JP2020077653A | 2020-05-21 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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