Title:
SUBSTRATE PROCESSING SYSTEM, AND CONVEYANCE METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075592
Kind Code:
A1
Abstract:
This substrate processing system includes a processing module, a vacuum conveyance module that is connected to the processing module and has a conveyance robot conveying a ring, a temperature adjustment unit that can adjust the temperature of the ring, and a control unit. The control unit performs, in order, a step for using the temperature adjustment unit to adjust the temperature of the ring before the ring is conveyed into the processing module, and a step for using the conveyance robot to convey the ring, the temperature of which has been adjusted by the temperature adjustment unit, and place the same on a substrate support unit.
Inventors:
OKAMURA TATSURU (JP)
MAKABE TOSHIYUKI (JP)
KITA MASATOMO (JP)
YANAGI YOSHIHIRO (JP)
MAKABE TOSHIYUKI (JP)
KITA MASATOMO (JP)
YANAGI YOSHIHIRO (JP)
Application Number:
PCT/JP2023/034920
Publication Date:
April 11, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; H01L21/3065
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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