Title:
SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/255189
Kind Code:
A1
Abstract:
This substrate processing method includes the following steps (A)-(D). (A) A laminated substrate is prepared, the laminated substrate including, in the following order, a first substrate, a first absorption layer that absorbs laser light, a second absorption layer that has a higher laser light absorption coefficient than the first absorption layer, a device layer, and a second substrate. (B) The first substrate is irradiated with the laser light from the opposite side thereof to the second substrate. (C) The laser light that has passed through the first substrate is irradiated onto the first absorption layer, and a modified layer is formed in the first absorption layer. (D) The first substrate and the second substrate are separated starting from the modified layer.
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Inventors:
MATSUBARA YOSHIHISA (JP)
TSUTSUMI YOSHIHIRO (JP)
YAMASHITA YOHEI (JP)
TSUTSUMI YOSHIHIRO (JP)
YAMASHITA YOHEI (JP)
Application Number:
PCT/JP2022/021409
Publication Date:
December 08, 2022
Filing Date:
May 25, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L23/12; H01L21/02; H01L21/301
Domestic Patent References:
| WO2021084902A1 | 2021-05-06 | |||
| WO2020111146A1 | 2020-06-04 |
Foreign References:
| JPH10125929A | 1998-05-15 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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