Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084850
Kind Code:
A1
Abstract:
The present invention comprises: a liquid film formation step in which a horizontally oriented substrate is held with a surface on which a pattern has been formed facing upward while supplying a processing liquid in which a sublimable substance has been dissolved in a solvent to the surface of the substrate to form a liquid film of the processing liquid on the surface of the substrate; a solidified film formation step in which the solvent is removed from the liquid film on the surface of the substrate to form a solidified film of the sublimable substance; a sublimation step in which the solidified film is sublimed and removed from the surface of the substrate; and a residue prevention step in which a residue prevention liquid is made to circulate to the peripheral edge section of the surface of the substrate via the peripheral edge section on the rear surface of the substrate after starting the sublimation of the solidified film and prior to the completion of sublimation of the solidified film to thereby prevent a residue from being generated at the peripheral edge section of the surface of the substrate.
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Inventors:
TSUKAHARA RYUTA (JP)
TANAKA TOMOYA (JP)
ZHANG SONG (JP)
TANAKA TOMOYA (JP)
ZHANG SONG (JP)
Application Number:
PCT/JP2023/032478
Publication Date:
April 25, 2024
Filing Date:
September 06, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2020035986A | 2020-03-05 | |||
| JP2020088124A | 2020-06-04 | |||
| JP2019114774A | 2019-07-11 | |||
| JP2006140385A | 2006-06-01 | |||
| JP2011135014A | 2011-07-07 | |||
| JP2021009988A | 2021-01-28 | |||
| JP2021010002A | 2021-01-28 | |||
| JP2017112220A | 2017-06-22 | |||
| JP2019054112A | 2019-04-04 | |||
| JP2019029491A | 2019-02-21 | |||
| JP2020064981A | 2020-04-23 | |||
| JP2020010015A | 2020-01-16 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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