Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND DATA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/220126
Kind Code:
A1
Abstract:
Provided are a substrate processing device, a substrate processing system, and a data processing method. The substrate processing device (100) comprises a thickness measurement unit (8), a control unit (102), and a storage unit (103). The thickness measurement unit (8) measures the thickness of an object (TG) included in a substrate (W). The control unit (102) inputs input data to a trained model (LM) and thereby causes processing parameters to be outputted from the trained model (LM). The storage unit (103) stores reference data (RE) that was acquired on the basis of a plurality of items of training data (LD) that were used in building the trained model (LM). The control unit (102) acquires pre-processing measurement data indicating the thickness of the object (TG) prior to substrate processing, and generates the input data on the basis of this pre-processing measurement data and target data indicating a target value for the thickness of the object (TG). The control unit (102) compares the input data and the reference data (RE) and determines whether or not to perform the substrate processing.
Inventors:
OTA TAKASHI (JP)
NAOHARA HIDEJI (JP)
IKEUCHI TAKASHI (JP)
HIRAOKA TETSUYA (JP)
NAOHARA HIDEJI (JP)
IKEUCHI TAKASHI (JP)
HIRAOKA TETSUYA (JP)
Application Number:
PCT/JP2022/016051
Publication Date:
October 20, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306
Foreign References:
| JP2021108367A | 2021-07-29 | |||
| JP2020040046A | 2020-03-19 | |||
| JP2020053550A | 2020-04-02 | |||
| JP2020053506A | 2020-04-02 | |||
| JP2018067610A | 2018-04-26 | |||
| JP2020120004A | 2020-08-06 | |||
| JP2021033510A | 2021-03-01 | |||
| JP2020032409A | 2020-03-05 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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