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Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/091239
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing apparatus and, more particularly, to a substrate processing apparatus which is capable of reducing adhesion of particles to a thin film due to a scattering, when a susceptor moves up and down, of powder etc., accumulated inside a bellows connected to a lower surface of a chamber.

More Like This:
WO/2022/206061SEMICONDUCTOR PROCESS CONTROL METHOD AND SEMICONDUCTOR PROCESS DEVICE
WO/2017/123780PLACING ULTRA-SMALL OR ULTRA-THIN DISCRETE COMPONENTS
Inventors:
HAN JIN-SOO (KR)
KIM SOO-CHEON (KR)
Application Number:
PCT/KR2019/012789
Publication Date:
May 07, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
TES CO LTD (KR)
International Classes:
H01L21/67; F16L11/11; H01L21/683; H01L21/687
Foreign References:
JPH11302829A1999-11-02
JP2010245564A2010-10-28
KR20070080536A2007-08-10
KR20040085983A2004-10-08
US20180305816A12018-10-25
Attorney, Agent or Firm:
LEE, Jae-Hong (KR)
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