Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/085061
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).
Inventors:
SATAKE MASAYUKI (JP)
Application Number:
PCT/JP2023/037016
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
G01J5/48; G01N25/72; H01L21/304
Domestic Patent References:
| WO2023026719A1 | 2023-03-02 |
Foreign References:
| JP2022038834A | 2022-03-10 | |||
| JP2000081403A | 2000-03-21 | |||
| JPH10153489A | 1998-06-09 | |||
| JPH09236491A | 1997-09-09 | |||
| JP2012216589A | 2012-11-08 | |||
| JP2019093331A | 2019-06-20 | |||
| JP2013130541A | 2013-07-04 | |||
| US20090196489A1 | 2009-08-06 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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