Title:
SUBSTRATE POLISHING METHOD, PROGRAM, AND SUBSTRATE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/223959
Kind Code:
A1
Abstract:
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a polishing surface; a top ring for holding a substrate and pressing the substrate against the polishing surface; and a vertical movement mechanism for vertically moving the top ring. The method includes: an acquisition step for acquiring information relating to a thickness of the substrate; a position adjustment step for adjusting a height position of the top ring relative to the polishing table on the basis of the acquired information relating to the thickness of the substrate; and a polishing step for polishing the substrate by supplying a pressurized fluid to a pressure chamber of the top ring to press the substrate against the polishing surface.
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Inventors:
SAITO AYUMU (JP)
Application Number:
PCT/JP2023/017893
Publication Date:
November 23, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/005; B24B37/013; B24B37/30; B24B41/06; B24B47/22; B24B49/12; H01L21/304
Foreign References:
| JP2020019115A | 2020-02-06 | |||
| JP2021094660A | 2021-06-24 | |||
| JP2010247301A | 2010-11-04 | |||
| JP2003158104A | 2003-05-30 | |||
| JPH0917760A | 1997-01-17 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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