Title:
SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/009762
Kind Code:
A1
Abstract:
This substrate liquid processing method includes: a step in which a substrate comprising wiring and a layered body that is provided on the wiring and includes an insulating film is prepared, said layered body having a recess that penetrates to the wiring and exposes the wiring; a step in which the section of the wiring that is exposed in the recess is dispersed by reverse sputtering and made to adhere, as a plating seed body, to a surface of the layered body, said surface including a demarcating surface that demarcates the recess; a step in which, with the plating seed body adhered to the demarcating surface, the demarcating surface is coated with a plating metal that is deposited through an electroless plating process; and a step in which, with the demarcating surface having been coated with the plating metal, the plating metal is inserted into the recess, either by an electroless plating process or an electroplating process.
Inventors:
FUJITA KEIICHI (JP)
IWASHITA MITSUAKI (JP)
KIKUCHI YUKI (JP)
IWASHITA MITSUAKI (JP)
KIKUCHI YUKI (JP)
Application Number:
PCT/JP2023/022850
Publication Date:
January 11, 2024
Filing Date:
June 21, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/768; H01L21/288; H01L21/3205; H01L23/532
Domestic Patent References:
| WO2019163531A1 | 2019-08-29 |
Foreign References:
| JP2003158145A | 2003-05-30 | |||
| JP2001316809A | 2001-11-16 | |||
| JP2008041700A | 2008-02-21 | |||
| JP2000183160A | 2000-06-30 | |||
| JP2003124214A | 2003-04-25 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
Download PDF: