SUBSTRATE JOINING METHOD USING RIVET, AND JOINING STRUCTURE

WIPO Patent Application WO/2012/117737

A1

The present invention makes it possible join substrates by rivet punching in such a manner that peeling and cracking are suppressed. The invention is a method of joining laminated substrates (CFRP) (1, 3) using SPRs (self piercing rivets) (5), with the laminated substrates (CFRP) (1,3) being punched by a rivet axle portion (15) of the SPRs (5), a crimp portion (17) being formed on the end of the rivet axle portion (15), and the laminated substrates (CFRP) (1, 3) being fastened and joined between a rivet head portion (19) and the crimp portion (17) The method is characterized in that metal washers (7, 9) that have inner holes (31) through which the rivet axle portion (15) can pass are stacked on and caused to abut non-joining surfaces (27, 29) of the laminated substrates (CFRP) (1, 3); the metal washers (7, 9) are used as a jig when punching out; the punching of the rivet axle portion (15) matches the inner holes (31) of the metal washers (7, 9); and that the joining is performed leaving the respective metal washers (7, 9) between the rivet head portion (19) or crimping portion (17), and the non-joining surfaces (27, 29).

UEDA MASAHITO (JP)
HASEGAWA HIROYUKI (JP)
WATANABE KINYA (JP)
FUJII NAOYA (JP)

PCT/JP2012/001424

September 07, 2012

March 01, 2012

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UNIV NIHON (JP)
FUKUI BYORA CO LTD (JP)
UEDA MASAHITO (JP)
HASEGAWA HIROYUKI (JP)
WATANABE KINYA (JP)
FUJII NAOYA (JP)

F16B5/04; F16B19/08

JP2005069451A	2005-03-17
JP2006234154A	2006-09-07
JP2005233413A	2005-09-02
JPH02275104A	1990-11-09
JP2003254309A	2003-09-10

SUDO, Yuichi (JP)
Yuichi Sudo (JP)

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