Title:
SUBSTRATE-HOLDING DEVICE AND METHOD FOR MANUFACTURING CONDUCTIVE-FILM-EQUIPPED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/032721
Kind Code:
A1
Abstract:
The present invention relates to a substrate-holding device including a mask member, a biaser, and a contact part. A contact member is provided with an inclined surface, an extending surface, and an abutting surface. A substrate is positioned by bringing the substrate, which is in a state of being biased by the biaser, and the mask member closer to each other in a first direction, guiding an outer edge section of the substrate to the abutting surface side along the inclined surface, and then causing the abutting surface to abut against the outer edge section of the substrate.
Inventors:
NAKAMURA SOTARO (JP)
TAKIKAWA JUMPEI (JP)
KATO SAYA (JP)
AKIBA KAZUKI (JP)
TAKIKAWA JUMPEI (JP)
KATO SAYA (JP)
AKIBA KAZUKI (JP)
Application Number:
PCT/JP2022/031468
Publication Date:
March 09, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
H01L21/683; C23C14/50
Foreign References:
| JP2016092025A | 2016-05-23 | |||
| JP2015175865A | 2015-10-05 | |||
| JP2006328518A | 2006-12-07 | |||
| JP2011214034A | 2011-10-27 | |||
| JP2016519778A | 2016-07-07 | |||
| JP2005088921A | 2005-04-07 | |||
| JP2008235294A | 2008-10-02 | |||
| JPH08313856A | 1996-11-29 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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