Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE CONVEYANCE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/139937
Kind Code:
A1
Abstract:
A substrate conveyance system according to the present invention includes: a substrate processing module including a substrate processing chamber, a substrate supporting portion, and a first temperature sensor that measures a temperature of the substrate supporting portion; a substrate conveyance module including a substrate conveyance chamber, a substrate conveyance robot that is provided with a first end effector that is capable of holding a high-temperature substrate, a second end effector that is capable of holding a low-temperature substrate, and a deposited matter detecting sensor that is situated near at least one of the end effectors, and a temperature management system that is provided with a coolant gas supply unit that supplies a coolant gas inside of the substrate conveyance robot, a second temperature sensor that measures a temperature inside of the substrate conveyance robot, and a temperature adjustment unit that performs temperature adjustment of the coolant gas on the basis of output of the second temperature sensor; and a control unit that executes a step for deciding which of the end effectors to use to convey the substrate, on the basis of output of the first temperature sensor, and a step for deciding a timing for cleaning inside of the substrate conveyance chamber on the basis of output of the deposited matter detecting sensor.

Inventors:
OKAMURA TATSURU (JP)
AMIKURA NORIHIKO (JP)
KITA MASATOMO (JP)
SHINDO TAKEHIRO (JP)
Application Number:
PCT/JP2022/044243
Publication Date:
July 27, 2023
Filing Date:
November 30, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B25J19/00
Domestic Patent References:
WO2015037701A12015-03-19
WO2019167235A12019-09-06
WO2020066571A12020-04-02
Foreign References:
JP2017017154A2017-01-19
JP2021034517A2021-03-01
JP2001291664A2001-10-19
JP2011205044A2011-10-13
JP2013139071A2013-07-18
US8430620B12013-04-30
JP2011176197A2011-09-08
JP2020017645A2020-01-30
JPH04186860A1992-07-03
JP2008006535A2008-01-17
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: CRANKSHAFT AND MANUFACTURING METHOD THEREFOR

Next Patent: WOODEN MATERIAL SHEET, WOODEN MATERIAL SHEET MANUFACTURING METHOD, MOLDING, AND MOLDING MANUFACTURIN...