Title:
SUB-MODULE FOR SINGLE PACKAGING TYPE SEMICONDUCTOR TRANSFORMER WITH EXCELLENT INSULATION AND INDUCTION HEATING PREVENTION PERFORMANCE
Document Type and Number:
WIPO Patent Application WO/2023/200062
Kind Code:
A1
Abstract:
The present invention relates to a sub-module for a single packaging type semiconductor transformer with excellent insulation and induction heating prevention performance, which can increase insulation performance by securing a separation distance between a high voltage unit and a low voltage unit in a semiconductor transformer, and can prevent induction heating by a magnetic field generated in a coil by including a shielding film with a predetermined conductivity or higher in the semiconductor transformer. The sub-module for a single packaging type semiconductor transformer with excellent insulation and induction heating prevention performance of the present invention comprises: a high voltage unit which converts high voltage low frequency alternating-current power into high voltage alternating-current power; a transformation unit which converts high voltage alternating-current power into low voltage alternating-current power; and a low voltage unit which converts low voltage alternating-current power into low voltage direct-current power.
Inventors:
SEO HAE WON (KR)
KIM SUNG JOO (KR)
JEONG BYUNG HWAN (KR)
KIM SUNG JOO (KR)
JEONG BYUNG HWAN (KR)
Application Number:
PCT/KR2022/018527
Publication Date:
October 19, 2023
Filing Date:
November 22, 2022
Export Citation:
Assignee:
HYOSUNG HEAVY IND CORP (KR)
International Classes:
H02M7/00; H01F27/02; H01F27/08; H01F30/06; H01F38/04; H02M3/00; H02M5/40
Foreign References:
| US20110149606A1 | 2011-06-23 | |||
| CN2256601Y | 1997-06-18 | |||
| KR200452571Y1 | 2011-03-08 | |||
| CN106129828B | 2018-07-06 | |||
| CN107578900A | 2018-01-12 | |||
| KR20200048376A | 2020-05-08 |
Attorney, Agent or Firm:
SU INTELLECTUAL PROPERTY (KR)
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