Title:
STYRENIC RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/024977
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a styrenic resin composition used for a molded product which is excellent in weatherability, mechanical strength, and oil resistance, without a reduction in heat resistance and transparency. The present disclosure is a styrenic resin composition containing: 10% by mass to 100% by mass of a styrene-unsaturated carboxylic acid resin (A) having a styrenic monomer unit (1) and an unsaturated carboxylic acid monomer unit (a1); and 0% by mass to 90% by mass of a (meta) acrylic resin (B) having an unsaturated carboxylic acid monomer unit (b1). The styrenic resin composition contains 0 to 2.0% by mass of a light stabilizer (C) and 0.001 to 2.0% by mass of an ultraviolet absorber (D) with respect to the total amount (100% by mass) of the styrenic resin composition.
Inventors:
KOBAYASHI MATSUTARO (JP)
IWAMOTO HIROKAZU (JP)
IWAMOTO HIROKAZU (JP)
Application Number:
PCT/JP2023/027872
Publication Date:
February 01, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
PS JAPAN CORP (JP)
International Classes:
C08L25/08; B29C45/00; C08F212/08; C08K5/05; C08K5/3435; C08K5/3475; C08L33/06
Domestic Patent References:
| WO2018008579A1 | 2018-01-11 | |||
| WO2013151055A1 | 2013-10-10 | |||
| WO2021161898A1 | 2021-08-19 |
Foreign References:
| JP2022041091A | 2022-03-11 | |||
| JP2020105403A | 2020-07-09 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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