Title:
STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/053336
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a structure in which breakage of a film during bending and/or expansion and contraction is suppressed. This structure comprises one or more flexible substrates and one or more films that are in contact with a surface of the substrate, the film including two-dimensional particles that include one or a plurality of layers, and a polymer, the layers including a layer body represented by the formula MmXn (in which M is at least one group 3, 4, 5, 6, or 7 metal, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is greater than n but no greater than 5), and a modification or terminal T (where T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) that is present on a surface of the layer body, the ratio of the two-dimensional particles in the film being 5-75 vol% with respect to the total content of the two-dimensional particles and the polymer, and the number-average particle diameter of the two-dimensional particles being 0.001-4 µm.
Inventors:
KONO TAKAYUKI (JP)
HIOKI YASUNORI (JP)
ABE MASANORI (JP)
HIOKI YASUNORI (JP)
ABE MASANORI (JP)
Application Number:
PCT/JP2023/029315
Publication Date:
March 14, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B32B27/18; B32B27/30; B32B27/40; C01B32/921; C08K3/01; C08K3/10; C08L101/00; H01B5/14
Domestic Patent References:
| WO2022080321A1 | 2022-04-21 | |||
| WO2022030444A1 | 2022-02-10 | |||
| WO2019211957A1 | 2019-11-07 | |||
| WO2022034852A1 | 2022-02-17 |
Foreign References:
| JP2020146236A | 2020-09-17 | |||
| JP2018201694A | 2018-12-27 | |||
| JP2021120965A | 2021-08-19 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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