Title:
STRUCTURAL BODY AND STRUCTURAL BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048110
Kind Code:
A1
Abstract:
Provided are: a structural body having a high Q value and a small size; and a structural body manufacturing method. The structural body comprises a planar inductor disposed on a substrate, and further comprises: a first magnetic body that is disposed, over a first insulation layer, more toward the substrate side than the planar inductor; a second magnetic body that is disposed, over a second insulation layer, more toward the side opposite the substrate side than the planar inductor; and a third magnetic body that is disposed at a center part of the planar inductor. In a normal direction of the substrate, the first magnetic body overlaps at least a portion of the second magnetic body and the third magnetic body. The first magnetic body is constituted of a first center part and a plurality of extension parts that extend from the first center part toward the outside in the in-plane direction. Alternatively, the first magnetic body is constituted of a flat plate part that covers at least a portion of a region from the center of the planar inductor to the outside. The second magnetic body is constituted of a second center part and a plurality of extension parts that extend from the second center part toward the outside in the in-plane direction. Alternatively, the second magnetic body is constituted of a flat plate part that covers at least a portion of a region from the center of the planar inductor to the outside.
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Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2023/026525
Publication Date:
March 07, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01F17/04; H01F1/26; H01F17/00; H01F41/04
Domestic Patent References:
WO2021117395A1 | 2021-06-17 |
Foreign References:
US5959522A | 1999-09-28 | |||
JPH01265505A | 1989-10-23 | |||
JPH09270332A | 1997-10-14 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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