SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2016/129621

A1

The purpose of the present invention is to reduce the occurrence of arcing during a production process, thereby improving the yield of the production process. This sputtering target is characterized by comprising a plurality of target members which are configured from a ceramic and are bonded to a base that is configured from a metal, with a bonding material being interposed therebetween, said bonding material being configured from a low-melting-point metal that has a melting point of 300°C or less. This sputtering target is also characterized in that: a surface of the base, with which the bonding material is in contact, has a surface roughness (Ra) of 1.8 μm or more; and each of the plurality of target members has a hollow cylindrical shape, while having a circular surface that faces an adjacent target member at a predetermined distance if the plurality of target members are bonded to the base so as to surround the outer circumferential surface of the base; and the circular surface has a surface roughness (Ra) of from 2.0 μm to 8.0 μm (inclusive).

OSADA KOZO (JP)
KAJIYAMA JUN (JP)

PCT/JP2016/053896

August 18, 2016

February 10, 2016

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JX NIPPON MINING & METALS CORP (JP)

C23C14/34; C04B35/00; C04B37/02

WO2014131458A1

2014-09-04

JP2010100930A	2010-05-06
JPH11236664A	1999-08-31
JP2001040471A	2001-02-13
JP2014105383A	2014-06-09
JP2000239838A	2000-09-05

Takahashi, Hayashi and Partner Patent Attorneys, Inc. (JP)
Patent business corporation Takahashi and wood and partners (JP)

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