SORTING METHOD FOR ELECTRONIC COMPONENT SCRAPS AND PROCESSING METHOD FOR ELECTRONIC COMPONENT SCRAPS

WIPO Patent Application WO/2022/102176

A1

Provided are: an electronic component scrap sorting method with which it is possible to appropriately determine a scrap mixture including multiple types of components; and an electronic component scrap processing method. This electronic component scrap sorting method comprises: a location/shape identification step for identifying the location and shape of each electronic component scrap from among multiple pieces of electronic component scraps having different shapes so as to obtain location/shape identification information that contains location information and shape information of the respective electronic component scraps; a feature analysis step for analyzing at least two features from each of the electronic component scraps so as to obtain feature analysis information; and a sorting step for, on the basis of the location/shape identification information and the feature analysis information, sorting the respective electronic component scraps by predetermined component types by using at least two features associated with one certain type of electronic component scraps that have the same shape and are at the same location.

AOKI KATSUSHI (JP)
KAWANO HIROSHI (JP)

PCT/JP2021/028211

May 19, 2022

July 29, 2021

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JX NIPPON MINING & METALS CORP (JP)

B09B5/00; B07C5/10

WO2020090941A1

2020-05-07

US20190299255A1	2019-10-03
JP2007505733A	2007-03-15
JP2020062633A	2020-04-23
JP2001009435A	2001-01-16
US20170014868A1	2017-01-19

AXIS PATENT INTERNATIONAL (JP)

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